Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling - Yahoo Finance

Applied Materials unveiled two new chipmaking systems—Centris™ Spectral™ SiN ALD and Producer™ Selectra™ Mo Etch—to address critical challenges in advanced 3D semiconductor manufacturing. As the indus... Read original →

Applied Materials’ new ALD and selective Mo etch platforms represent a materials-engineering-led redefinition of semiconductor manufacturing as dimensional scaling hits physical walls. This will directly boost GAA transistor yield at Taiwan, China-based foundries like TSMC and address NVIDIA’s urgent need for power-efficient, high-density logic in AI accelerators. Tightening U.S. export controls on advanced tools raise compliance costs and deepen supply chain fragmentation, disadvantaging non-U.S. fabs. Competitors such as Lam Research and Tokyo Electron lack Applied’s co-optimized materials-process-equipment stack, likely pushing them toward niche etch solutions or chiplet-based alternatives. Within 18 months, 'process-by-materials' will dominate sub-3nm development, elevating equipment makers from tool vendors to de facto technology architects.