Semiconductor News & Analysis Feed
67 articles
2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
Share this article
0
Join the conversatio
2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-28
www.eurekalert.org
2026-05-28
EurekAlert!
__fail__
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-26
www.actuia.com
2026-05-26
Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031
Table of contents
A Temporal Scaling Law to Succeed Moore
LogicFolding: 3D Against EUV, and Its Shades
A 3D Architecture That Isn't Uniquely Huawei's
He Tingbo, the Tutelary Figure of HiSilicon
On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
2026-05-26
overclock3d.net
2026-05-26
OC3D
__fail__
2026-05-26
www.digitimes.com
2026-05-26
digitimes
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they vis
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-25
overclock3d.net
2026-05-25
OC3D
Published: May 25, 2026 | Source: Taiwan Commercial Times | Author: Mark Campbell
AMD Zen 7 Details Leak – “Grimlock” to use TSMC A14 node
AMD has big plans for Zen 7 – More cores, more cache, and TSMC A14 silicon
AMD is reportedly planning to use TSMC’s A14 lithography node for its Zen 7 “Grimlock” desktop CPUs. The Taiwan Commercial Times has reported that AMD is already preparing its supply c
2026-05-25
digitimes.com
2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-24
tomshardware.com
2026-05-24
Mark Tyson
The first Cray T3D supercomputer ever produced, serial number 6001, was recently put up for auction, with opening bids from £60,000 (~$81,000) invited.
2026-05-24
tomshardware.com
2026-05-24
Denise Bertacchi
Viral footage shows a scorched mess, should the A1 be recalled?
2026-05-22
overclock3d.net
2026-05-22
OC3D
__fail__
2026-05-20
tspasemiconductor.substack.com
2026-05-20
semivision
__fail__
2026-05-14
overclock3d.net
2026-05-14
OC3D
__fail__
2026-05-14
www.digitimes.com
2026-05-14
digitimes
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now