Semiconductor News & Analysis Feed

Amkor Technology (AMKR) is expanding its 2.5D packaging pipeline, positioning it as a key growth lever amid the industry shift toward chiplet-based architectures driven by AI and high-performance computing. As semiconductor performance increasingly relies on package-level integration rather than tra

SK Hynix is reportedly testing Intel's EMIB 2.5D packaging technology amid TSMC CoWoS supply constraints, highlighting the semiconductor industry's competitive landscape and supply chain diversification needs. EMIB technology enables high-performance, high-density chip integration through silicon in