Semiconductor News & Analysis Feed

12102 articles
2026-06-16
www.thefastmode.com 2026-06-16 The Fast Mode
QumulusAl, a vertically integrated AI cloud infrastructure company, announced it has secured more than $124 million in customer subscriptions for 3-year terms with Hyperbolic and another leading AI inference platform. These agreements support deployments totaling 1,280 NVIDIA Blackwell GPUs and include nearly $21.9 million in combined upfront customer commitments. The customers operate some of t
2026-06-16
finance.yahoo.com 2026-06-16 Yahoo Finance
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions Simply Wall St Mon, June 15, 2026 at 8:20 PM PDT 2 min read QCOM -3.05% Trade QCOM on Coinbase Trading disclosure Find winning stocks in any market cycle. Join 7 million investors using Simply Wall St's investing ideas for FREE. Qualcomm, ticker NasdaqGS:QCOM, is reportedly in talks to acquire AI chip startup Tenstorrent
2026-06-16
www.msn.com 2026-06-16 MSN
Elon Musk’s SpaceX went public on Friday, exploding onto the scene with a valuation that quickly eclipsed $2 trillion. Things went swimmingly for a while, with shares steadily rising from a debut $150 — a premium of 11 percent over the original asking price — on Friday to well over $200 on Tuesday. But after peaking at $222 Tuesday morning, SpaceX started its first sustained decline of its nascen
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
Suess Microtec, DE000A1K0235 New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand 16.06.2026 - 05:05:28 | ad-hoc-news.de Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools. Suess Microtec, DE000A1K0235 Edited
2026-06-16
www.morningstar.com 2026-06-16 Morningstar
Home News Business Wire Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools Provided by Business Wire Jun 16, 2026, 10:00:00 AM Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Elect
2026-06-16
autonews.gasgoo.com 2026-06-16 Gasgoo
Home / ICV / Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip Li Auto Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip Monika From Gasgoo | June 16 , 2026 10:34 BJT f SHARE TWEET in SHARE SHARE Gasgoo Munich- Li Auto used its Livis Day software and embodied intelligence event to introduce a new flagship cockpit
2026-06-16
www.digitimes.com 2026-06-16 digitimes
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me si
2026-06-16
www.barchart.com 2026-06-16 Barchart.com
NVIDIA Corp logo outside building-by BING-JHEN_HONG via iStock Nvidia (NVDA) is back in the bond market for the first time in five years, and the size of the deal is getting attention. The chipmaker is seeking to raise at least $20 billion, with reports saying the final sale could reach $25 billion after strong demand pushed orders to about $85 billion. Nvidia says the proceeds will go toward gen
2026-06-16
www.bastillepost.com 2026-06-16 bastillepost.com
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026-- Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
www.joplinglobe.com 2026-06-16 The Joplin Globe
Generally cloudy. High 84F. Winds SW at 5 to 10 mph.. [Murata Manufacturing Co., Ltd.] New collaboration with Synopsys Sorry, there are no recent results for popular commented articles. Sign up now to get our FREE breaking news coverage delivered right to your inbox. First Amendment: Congress shall make no l
2026-06-16
www.caledonianrecord.com 2026-06-16 Caledonian Record
PREV Previous PREVIOUS Friday Harbor expands AI pre-underwriting to condo and manuf… - Expansion helps lenders navigate two of mortgage lending's… NEXT Next Up NEXT UP Otovo to Acquire Green Panel for $11 Million to Scale Global Energy Services Pla… OSLO, Norway--(BUSINESS WIRE)--Jun 16, 2026-- AP Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic
2026-06-16
www.ncnewsonline.com 2026-06-16 New Castle News
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026-- Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
sg.finance.yahoo.com 2026-06-16 Yahoo Finance Singapore
This is a paid press release. Contact the press release distributor directly with any enquiries. Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools Business Wire Mon, 15 June 2026 at 7:00 pm GMT-7 3 min read SNPS -1.32% 6981.T +0.43% [Murata Manufacturing Co., Ltd.] New collaboration with Synopsys KYOTO, Japan, June 16, 2026--(B
2026-06-16
via.tt.se 2026-06-16 Via TT
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools 16.6.2026 04:00:00 CEST | Business Wire | Press Release Share Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access an
2026-06-16
www.channelnewsasia.com 2026-06-16 CNA
Singapore PUB channels S$12 million to develop water efficiency solutions for wafer fabrication, data centres: DPM Gan The data centre and chipmaking industries are water-intensive and provide critical components and services for artificial intelligence. A file photo of an employee walking through a data centre. (Photo: REUTERS/Priyanshu Singh) Listen 5 min New: You can now listen to articles.
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
ASE Tech, TW0003711008 New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips 16.06.2026 - 03:43:12 | ad-hoc-news.de ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers. AS
2026-06-16
www.marketscreener.com 2026-06-16 marketscreener.com
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2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
Infineon, DE0006231004 New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers 16.06.2026 - 03:15:46 | ad-hoc-news.de Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms. Infineon
2026-06-16
www.prnewswire.com 2026-06-16 PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing NEWS PROVIDED BY Rapidus Corporation Jun 15, 2026, 21:00 ET SHARE THIS ARTICLE New collaboration provides framework between the Japan government and Italy TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
finance.yahoo.com 2026-06-16 Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries. Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing PR Newswire Mon, June 15, 2026 at 6:00 PM PDT 3 min read New collaboration provides framework between the Japan government and Italy TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that