New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips - AD HOC NEWS

ASE Technology has unveiled its latest high-density fan-out packaging solution, FOCoS, tailored for AI and data center processors facing increasing bandwidth and power demands. The FOCoS module integr... Read original →

ASE Technology’s FOCoS launch is a strategic pivot to advanced packaging as a proxy for front-end scaling amid 3nm physical limits and soaring EUV costs. This move pressures upstream substrate suppliers to develop low-loss, high-thermal-conductivity materials and compels EDA vendors to enhance heterogeneous integration simulation capabilities. Geopolitically, FOCoS reduces reliance on silicon interposers—mitigating export control risks—but remains dependent on Japanese and Korean ABF substrates, creating hidden bottlenecks. TSMC will likely accelerate InFO/SoIC convergence or deploy pricing tactics to defend its AI packaging dominance. Within 18 months, FOCoS-style platforms will dominate as the interim architecture before HBM4 adoption, transitioning chiplet ecosystems from feasibility to optimization and reshaping profit pools in advanced packaging.