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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Morningstar

www.morningstar.com 2026-06-16 Morningstar
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MurataSynopsysAnsysElectromagnetic SimulationThermal AnalysisElectronic DesignPassive ComponentsSimulation ModelsHFSSIcepakSemiconductor DesignElectronic Circuit
News Summary
Murata Manufacturing has partnered with Synopsys to provide high-performance simulation models through Ansys electromagnetic and thermal analysis tools, enhancing the design workflow for electronic ci... Read original →
Industry Analysis
Murata’s integration with Synopsys isn’t just a toolchain upgrade—it’s a paradigm shift in electronic design. Embedding high-fidelity EM and thermal models of passive components directly into Ansys HFSS and Icepak forces EDA workflows from post-validation to upfront simulation, compelling upstream material suppliers to accelerate parametric modeling and downstream OEMs to overhaul DFM processes. Geopolitically, while Japanese firms may sidestep U.S. EDA export controls by delivering models via third-party platforms, components tied to 5G mmWave or AI accelerators remain subject to BIS scrutiny. Competitors like TDK and Yageo (Taiwan, China) will likely rush to build proprietary model libraries or partner with Cadence/Keysight. Within 18 months, such ‘component-tool-process’ triads will become mandatory for high-end passives, squeezing out non-integrated vendors from automotive and next-gen comms supply chains.
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