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Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.

The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads pushing the industry from doubler-based designs to direct native multi-phase control. Industry insiders say the growing shortage of power components has three main causes: inventory corrections over the past three yea

[News] MIT Announced Breakthrough in GaN-on-Single-Crystal Diamond Thermal Management Technology 2026-06-22 Semiconductors editor News On June 8, 2026, the Massachusetts Institute of Technology (MIT) announced that its researchers had successfully embedded gallium nitride (GaN) transistors into an ultra-thin single-crystal diamond layer, overcoming a major thermal bottleneck in high-power

Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management By Electronics Media - June 9, 2026 Share on Facebook Tweet on Twitter tweet Isolated Through-Hole Package for SiC MOSFETs – Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors,

Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Get the latest news delivered to your inbox Sign up for The Manila Times newsletters By signing up with an email address, I acknowledge t

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Tech Industry Manufacturing Semiconductors Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management News By Luke James published 20 minutes ago China now has a prototype tool designed for vertical circuit stacking. (Image credit: Getty Images) Share this article 0 Join the conversatio

Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t

SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.