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Trending Technologies
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2026-09-30
LG Innotek Accelerates Corporate Transformation Driven by Semiconductor Substrates and Physical AI - PR Newswire
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www.prnewswire.com 2026-09-30
2026-09-26
SCHMID surges after Nvidia, AMD, Intel consider using glass substrates in chips - Seeking Alpha
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seekingalpha.com 2026-09-26
2026-09-24
Nvidia Weighs Glass Substrates to Stack More HBM on AI Chips - Seoul Economic Daily
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en.sedaily.com 2026-09-24
2026-09-23
SKC raises Absolics stake to 82% as glass substrates remain in testing
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digitimes.com 2026-09-23
2026-09-16
Glass substrates, TGV set to reshape 2027 advanced packaging race - digitimes
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www.digitimes.com 2026-09-16
2026-09-16
Glass substrates, TGV set to reshape 2027 advanced packaging race
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digitimes.com 2026-09-16
2026-09-16
FSC teams with South Korean maker on TGV equipment for glass substrates
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digitimes.com 2026-09-16
2026-09-15
Aluminium Nitride Thermal Substrates Market To 2035: Wide-Bandgap Semiconductor Demand Fuels Growth - News and Statistics - IndexBox
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www.indexbox.io 2026-09-15
2026-09-12
Fabships Aim to Exploit ‘Free’ Space Vacuum for Compound Semiconductor Substrates
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eetimes.com 2026-09-12
Startup Besxar has successfully completed its first space mission to explore the feasibility of using the vacuum environment of space for manufacturing compound semiconductor substrates. The company sent GaN-on-sapphire, undoped silicon, and bare sapphire wafer samples aboard a SpaceX Falcon 9 first
Compound SemiconductorsSpace ManufacturingVacuum EnvironmentGaNSemiconductor FabricationSpace TechnologyCleanroomMicrogravity
2026-09-01
Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan
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digitimes.com 2026-09-01
2026-08-25
Coherent begins sampling 300mm SiC substrates for AI thermal management - Evertiq
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evertiq.com 2026-08-25
2026-08-24
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials - digitimes
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www.digitimes.com 2026-08-24
2026-08-24
[News] Coherent Samples 300 mm SiC Substrates for Next-Gen AI Cooling - TrendForce
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www.trendforce.com 2026-08-24
2026-08-24
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
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digitimes.com 2026-08-24
2026-08-23
Glass Substrates Emerge as Chip Battleground; Korea's HBM Lead Hinges on Packaging - Seoul Economic Daily
0.92
en.sedaily.com 2026-08-23
2026-08-19
Coherent Begins Customer Sampling of 300mm High Thermal Conductivity SiC Substrates for AI Infrastructure - hpcwire.com
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news.google.com 2026-08-19
2026-08-18
Coherent Begins Customer Sampling of 300mm High Thermal Conductivity Silicon Carbide Substrates for AI Infrastructure - Finviz
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finviz.com 2026-08-18
2026-08-11
CoWoS Capacity Gap Narrows; TSMC Warns ABF Substrates Will Be the Next Bottleneck in Advanced Packaging - finance.biggo.com
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finance.biggo.com 2026-08-11
At the OCP APAC Summit, TSMC's Vice President of Advanced Packaging Technology and Services, He Jun, revealed that with CoWoS capacity doubling for three consecutive years, supply is now 'very close' to market demand. However, the advanced packaging supply chain bottleneck is shifting from memory to
Advanced PackagingCoWoSTSMCABF SubstratesSemiconductor Supply ChainAI ChipsWafer FoundrySemiconductor Manufacturing
2026-08-09
Thermal Shock-Resistant Substrates Market to Reach 193 Index by 2035 on Sic and Gan Fab Expansion - IndexBox
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news.google.com 2026-08-09
2026-07-29
Shanghai Aishengna: The Secretive Company Behind China’s Latest DUV Lithography Push Thoroughly Unmasked, As Beijing Hedges With Glass Substrates And An EUV Prototype - Wccftech
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wccftech.com 2026-07-29