Semiconductor News & Analysis Feed
33 articles
2026-07-21
digitimes.com
2026-07-21
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products expected with the DDR6 generation.
2026-07-18
digitimes.com
2026-07-18
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates remain widely used, but rising demand for high-density interconnects, lower signal loss, and better dimensional stability is pushing glass substrates closer to commercial adoption.
2026-07-16
digitimes.com
2026-07-16
As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese c
2026-07-14
digitimes.com
2026-07-14
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing. The latest sales data suggest the upgrade cycle is broadening beyond one segment, with advanced ABF substrates and high-end CCL benefiting from higher specifications, better pricing, and rising AI content. For inves
2026-07-14
digitimes.com
2026-07-14
Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new o
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
digitimes.com
2026-07-10
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
2026-07-10
bioengineer.org
2026-07-10
Bioengineer.org
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Contact your hosting provider letting them know your web server is not completing requests. An Error 522 means that the request was able to connect to your web server, but that the request didn't finish. The most likely cause is that something on your server is
2026-07-07
compoundsemiconductor.net
2026-07-07
Compound Semiconductor
News Article
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Scrutinising 50 mm AlN substrates
Tuesday 7th July 2026
AlN substrates feature local variations in defect density and buried aluminium platelets
The recent availability of AlN substrates with diameters of up to 100 mm could be a game-changer for a number of compound semiconductor devices.
This foundation provides a native plat
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com
2026-07-06
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.
2026-07-02
digitimes.com
2026-07-02
China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on S
2026-06-26
digitimes.com
2026-06-26
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
2026-06-23
digitimes.com
2026-06-23
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator, extending the companies' supply relationship from mobile and PC chips into server-class semiconductors, ZDNet Koreareported.
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
biz.chosun.com
2026-06-18
Chosunbiz
By
Jeong Du-yong
Published 2026.06.18. 06:02
Glass substrate from Appslix, SKC's semiconductor substrate manufacturing subsidiary./Courtesy of Appslix
TSMC, the world's largest foundry (contract semiconductor manufacturing) corporations, disclosed verification results for the commercialization of glass semiconductor substrates developed in an ecosystem centered on Taiwan and Japan. As a result,
2026-06-17
wccftech.com
2026-06-17
Wccftech
The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC