digitimes.com
2026-05-19
China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor Manufacturing International (SMIC) and Hua Hong Semiconductor, domestic Chinese foundries have not stalled under US sanctions; instead, they are accelerating efforts to build a China-specific foundry ecosystem amid t
digitimes.com
2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man