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2026-06-19
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer
News-analysis
By Luke James published June 19, 2026
EUV-printed 28nm gates and 94% working devices, all on standard production tooling.
(Imag