SemiPulse — Semiconductor Intelligence

Semiconductor Metrology/Inspection Is Capturing the Economics of Advanced Packaging - Dr. Robert Castellano's Semiconductor Deep Dive Newsletter

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drrobertcastellano.substack.com 2026-05-12 Dr. Robert Castellano's Semiconductor Deep Dive Newsletter

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Taiwan AI testing boom lifts KYEC, MPI, and WinWay to record 2026 revenue

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digitimes.com 2026-05-12

Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.

TSMC's US and Japan expansion lifts Trusval

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digitimes.com 2026-05-12

Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's accelerated expansion of 2nm process and advanced packaging capacity, and ongoing fab construction projects across the semiconductor, high-tech, and memory industries.

TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

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digitimes.com 2026-05-12

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.

Intel gains on reports SK Hynix partnership could boost chip-packaging business - Invezz

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invezz.com 2026-05-12 Invezz

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Intel gains on reports SK Hynix partnership could boost chip-packaging business - TradingView

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www.tradingview.com 2026-05-12 TradingView

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Taiwan Semiconductor’s Dominance in Packaging Faces Subtle Shifts: SK Hynix Collaborates with Intel to Test EMIB Technology, Potentially Triggering Significant Changes in the AI Chip Supply Chain - Moomoo

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www.moomoo.com 2026-05-11 Moomoo

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Quantum Computing Advanced Packaging Market Accelerates Growth with Forecast to $241.8M by 2033 - SRI - openPR.com

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www.openpr.com 2026-05-11 openPR.com

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Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration - Tom's Hardware

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www.tomshardware.com 2026-05-11 Tom's Hardware

Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with

Semiconductor packaging High-bandwidth memory EMIB technology Chip manufacturing SK hynix Intel AI data centers Memory market

SK Hynix and Intel team up on 2.5D packaging to connect HBM with logic chips - Crypto Briefing

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cryptobriefing.com 2026-05-11 Crypto Briefing

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[News] SK hynix Reportedly Tests Intel EMIB 2.5D Packaging With HBM Amid TSMC CoWoS Tightness - TrendForce

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www.trendforce.com 2026-05-11 TrendForce

HomeNews

Semiconductor Packaging EMIB Technology HBM Memory TSMC SK Hynix Intel 2.5D Packaging Chip Manufacturing

Wooptix Targets AI Packaging Bottleneck with Astronomy Tech

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eetimes.com 2026-05-11

A Canary Islands startup brings wavefront imaging to semiconductor metrology, aiming to tackle wafer shape challenges in 3D integration.

Semiconductor Packaging AI Processors Advanced Packaging 3D Integration Wavefront Sensing Wafer Metrology Wafer Warpage Optical Measurement

SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain - Wccftech

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wccftech.com 2026-05-11 Wccftech

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SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory - TechPowerUp

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www.techpowerup.com 2026-05-11 TechPowerUp

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New option for HBM packaging? SK Hynix may collaborate with Intel, with EMIB technology gaining favor. - 富途牛牛

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news.futunn.com 2026-05-11 富途牛牛

访问频繁，请稍后重试您所要访问的页面不在这儿，它可能正忙着刷牛牛圈，稍后就能恢复正常返回主页

HBM packaging Memory chips Semiconductor packaging SK Hynix Intel EMIB technology Advanced packaging Memory storage

New option for HBM packaging? SK Hynix may collaborate with Intel, with EMIB technology gaining favor. - Moomoo

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www.moomoo.com 2026-05-11 Moomoo

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Malaysia eyes 7 percent global advanced packaging share by 2035 - TNGlobal

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technode.global 2026-05-11 TNGlobal

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DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test - digitimes

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www.digitimes.com 2026-05-11 digitimes

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.The article requires paid subscription.Subscribe Now

Semiconductor Industry Chip Design Packaging and Testing TSMC MediaTek Intel Warren Buffett Investment Apple

DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test - digitimes

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www.digitimes.com 2026-05-11 digitimes

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.The article requires paid subscription.Subscribe Now

Semiconductor Industry Chip Design Wafer Foundry Supply Chain Investment Analysis Technology News Market Dynamics Technology Development

ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029 - digitimes

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www.digitimes.com 2026-05-11 digitimes

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant,...The article requires paid subscription.Subscribe Now

Semiconductor Packaging Advanced Packaging Taiwan Semiconductor Industry AI Chip Demand Wafer Fab Expansion Semiconductor Equipment Investment Supply Chain Integration Chip Manufacturing