Semiconductor News & Analysis Feed
547 articles
2026-05-31
www.tekedia.com
2026-05-31
Tekedia
MediaTek Accepts Both Intel And TSMC Packaging As AI Chip Boom Reshapes Semiconductor Supply Chains
May 31, 2026 | by Samuel Nwite | 0
Taiwanese chip designer MediaTek is positioning itself as a rare neutral player in one of the semiconductor industry’s most consequential battles, embracing both Taiwan Semiconductor Manufacturing Co. (TSMC) and Intel’s advanced packaging technologies as demand f
2026-05-31
www.thelec.net
2026-05-31
thelec.net
Solder balls used in semiconductor packaging. (Photo: THE ELEC)
South Korean prosecutors have launched a forced investigation after uncovering allegations that semiconductor packaging material suppliers colluded on pricing and supply volumes.
The Criminal Proceeds Recovery Division of the Seoul Central District Prosecutors' Office, headed by Chief Prosecutor So Jung-soo, began search and seizure
2026-05-31
digitimes.com
2026-05-31
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in the second half of 2026. However, its transformation strategy is accelerating. Among its new businesses, optical waveguide products used in AI glasses and other applications began small-volume shipments in the first qua
2026-05-30
telecom.economictimes.indiatimes.com
2026-05-30
ET Telecom
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2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-30
digitimes.com
2026-05-30
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
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2026-05-30
wtvbam.com
2026-05-30
WTVB
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-29
www.zacks.com
2026-05-29
Zacks Investment Research
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2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.
2026-05-29
wkzo.com
2026-05-29
WKZO
By Wen-Yee Lee
TAIPEI, May 29 (Reuters) – Taiwan chip designer MediaTek said on Friday it supports both TSMC’s and Intel’s advanced packaging technologies, allowing customers to choose between the two approaches.
“We’re one of the few custom silicon providers that support both (TSMC’s) CoWoS and (Intel’s) EMIB. We let our customers choose,” MediaTek Senior Vice President Vince Hu told reporter
2026-05-29
finimize.com
2026-05-29
Finimize
The chip designer says it supports both TSMC’s CoWoS and Intel’s EMIB as it targets $2 billion of 2026 data center revenue.
MediaTek, a Taiwanese chip designer best known for smartphone processors, says it can package custom AI data-center chips using either TSMC’s CoWoS or Intel’s EMIB, giving customers two routes to get to mass production.
“Advanced packaging” is the step that connects multipl
2026-05-29
www.thestar.com.my
2026-05-29
thestar.com.my
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2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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2026-05-29
asia.nikkei.com
2026-05-29
Nikkei Asia
Move a win for US chip titan as it looks to secure customers for foundry services
Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters)
TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in