Semiconductor News & Analysis Feed
42 articles
2026-07-16
digitimes.com
2026-07-16
As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese c
2026-07-16
digitimes.com
2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
news.google.com
2026-07-14
digitimes
2026-07-13
digitimes.com
2026-07-13
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including FormFactor, Advantest, Tokyo Electron (TEL), Teradyne, MPI, Keysight, Anritsu, ficonTEC, ADS Tech (ADST), All Ring Tech, GMT Global, Chroma ATE, Hon Precision, and WinWay Technology are rushing to secure a foothold in t
2026-07-10
digitimes.com
2026-07-10
A veteran chip engineer turned venture capitalist used a panel at Taipei's Asia VC Summit on Wednesday to challenge two of the semiconductor industry's most fashionable narratives: that AI will solve chip design, and that co-packaged optics (CPO) is ready for prime time.
2026-07-10
digitimes.com
2026-07-10
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's advantages in common packaging optics (CPO) amid market attention on Corning's Glass Bridge technology.
2026-07-09
eetimes.com
2026-07-09
Imec researchers argue that co-packaged optics will not be enough for future AI systems, pushing the industry toward 2.5D and eventually 3D optical I/O.
2026-07-05
digitimes.com
2026-07-05
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence (AI) and high-performance computing workloads increase demand for silicon photonics and co-packaged optics in data centers.
2026-06-30
digitimes.com
2026-06-30
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a re
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-26
digitimes.com
2026-06-26
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array
2026-06-25
bits-chips.com
2026-06-25
Bits&Chips
Headline
Japanese researcher proposes simpler high-NA EUV optics design
25 June 2026
Paul van Gerven
Editor at Bits&Chips
Reading time: 1 minute
A researcher at the Okinawa Institute of Science and Technology (OIST) has proposed a new optical architecture for high-NA EUV lithography. The approach replaces today’s highly complex optical layouts with a simpler in-line configuration that uses carefu
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-23
digitimes.com
2026-06-23
China's memory industry is undergoing another round of ownership restructuring. According to a recent merger review case disclosed by China's State Administration for Market Regulation (SAMR), YMTC Holdings, the parent company of Yangtze Memory Technologies (YMTC), will sell its 39% stake in Wuhan Xinxin Semiconductor Manufacturing (XMC) to Wuhan Optics Valley Semiconductor Industry Investment.
2026-06-22
roadtovr.com
2026-06-22
Road to VR
Meta Ray-Ban Display | Courtesy Meta, EssilorLuxottica
EssilorLuxottica Partners with Applied Materials to Scale AR & Smart Glasses Optics
SCOTT HAYDEN
June 22, 2026
1
EssilorLuxottica and Applied Materials have signed a long-term joint development agreement, which the companies say will accelerate the commercialization of next-gen optical systems for AR and AI-powered smart glasses.
EssilorLuxo
2026-06-18
news.google.com
2026-06-18
Pulse 2.0
2026-06-18
www.theregister.com
2026-06-18
The Register
NETWORKS
Nvidia-backed optics vendor to boost wafer output by 4x to meet AI interconnect demand
Jensen can't risk semiconductor supply chains derailing the AI hype train
Tobias Mann
Systems editor
0
Published Wed 17 Jun 2026 // 18:12 UTC
As AI systems grow larger, optics are playing a larger part in their design – so much so that at Computex earlier this month, Nvidia CEO Jensen Huang proclaim
2026-06-17
www.visionmonday.com
2026-06-17
VisionMonday.com
BUSINESS
EssilorLuxottica and Applied Materials Partner on AR Optics Platforms for Next-Gen Smart Glasses
By Staff
Wednesday, June 17, 2026 12:24 AM
PARIS and SANTA CLARA, Calif.—EssilorLuxottica (ESLX.PA) and Applied Materials, Inc. (NASDAQ: AMAT) have announced a long-term joint development agreement in which they aim to accelerate the commercialization of next-generation intelligent optica