Semiconductor News & Analysis Feed
20 articles
2026-09-08
news.google.com
2026-09-08
2026-09-05
2026-08-28
www.expreview.com
2026-08-28
2026-08-28
www.koreaherald.com
2026-08-28
2026-08-28
en.yna.co.kr
2026-08-28
SK Hynix held a groundbreaking ceremony for its High Bandwidth Memory (HBM) production facility in West Lafayette, Indiana, on August 27, 2026. The $4 billion investment marks SK Hynix's first next-generation HBM production hub in the U.S., with plans to begin mass production of HBM4E chips in the s
2026-08-28
www.purdueexponent.org
2026-08-28
2026-08-28
www.young.senate.gov
2026-08-28
2026-08-28
2026-08-28
news.skhynix.com
2026-08-28
2026-08-28
www.manilatimes.net
2026-08-28
2026-08-27
www.forth.news
2026-08-27
2026-08-27
2026-08-27
2026-08-27
2026-08-27
wtvbam.com
2026-08-27
SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations
2026-08-27
www.reuters.com
2026-08-27
2026-08-13
www.thelec.net
2026-08-13
2026-08-12
www.koreajoongangdaily.com
2026-08-12
2026-08-12
www.chosun.com
2026-08-12
2026-08-11
finance.biggo.com
2026-08-11
Siliconware Precision Industries (SPIL), a leading global semiconductor packaging and testing company and subsidiary of ASE Technology Holding (3711-TW), held a groundbreaking ceremony for its new Douliu plant in Yunlin Industrial Park on August 11, announcing an investment of nearly NT$100 billion