Semiconductor News & Analysis Feed
103 articles
2026-06-15
www.gadgets360.com
2026-06-15
Gadgets 360
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2026-06-15
www.gadgets360.com
2026-06-15
Gadgets 360
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2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
Infineon, DE0006231004
Flagship power electronics, Infineon HybridPACK Drive G2 sets EV efficiency tone
15.06.2026 - 12:52:30 | ad-hoc-news.de
Infineon’s HybridPACK Drive G2 module is at the heart of many new electric vehicles, promising higher power density and efficiency for 800-volt drivetrains. The flagship inverter module underpins the chipmaker’s push into mass-market e-mobility platforms.
2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
Texas Instruments, US8825081040
Battery efficiency focus, Texas Instruments TPS562231 buck converter targets space-limited designs
15.06.2026 - 12:28:43 | ad-hoc-news.de
With its TPS562231 synchronous buck converter, Texas Instruments targets engineers building compact, cost-sensitive systems that still demand solid power efficiency. The 2 A regulator comes in a tiny SOT-563 package and supports
2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
ON Semiconductor, US6821891035
High-efficiency drive: how onsemi’s EliteSiC 1200 V MOSFET targets EV inverters
15.06.2026 - 11:58:52 | ad-hoc-news.de
Onsemi’s EliteSiC 1200 V MOSFET family sits at the heart of many next-generation electric vehicle inverters, promising higher efficiency, lower losses and more compact designs for automakers and Tier-1 suppliers focused on range and cost.
ON Semico
2026-06-15
www.megabites.com.ph
2026-06-15
megabites.com.ph
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for rea
2026-06-13
www.indexbox.io
2026-06-13
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2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-11
digitimes.com
2026-06-11
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure aimed at activating assets and focusing on its core business. It is also intended to improve the group's capital allocation efficiency, optimize its balance sheet, and boost earnings per share (EPS).
2026-06-10
eetimes.com
2026-06-10
As AI models scale to trillions of parameters, conventional memory architectures face mounting capacity and efficiency constraints.
2026-06-10
digitimes.com
2026-06-10
WD is preparing for a global wave of AI data growth by prioritizing hard drives with higher capacity, faster performance, and lower power consumption. The company says the shift reflects how AI training and inference are generating more data than traditional systems can handle, making storage efficiency and affordability increasingly important worldwide.
2026-06-09
www.stocktitan.net
2026-06-09
Stock Titan
Wolfspeed Unveils the Industry’s Lowest RDS(ON) Silicon Carbide (SiC) MOSFETs in New Technology Generation
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2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs
By Electronics Media -
June 9, 2026
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ROHM TSC3PAK SiC MOSFET Package – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product
2026-06-08
www.thelec.net
2026-06-08
thelec.net
Infineon's EiceDRIVER 1EDI3040AS. (Photo: Infineon)
Infineon Technologies on June 3 local time introduced new gate driver integrated circuits (ICs) for electric vehicle (EV) traction inverters, named EiceDRIVER 1EDI3040AS and 1EDI3041AS.
Gate drivers are chips that send switching signals to power semiconductor devices. In traction inverters, these switches rapidly open and close to convert batte
2026-06-08
www.marketscreener.com
2026-06-08
marketscreener.com
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2026-06-08
electronics360.globalspec.com
2026-06-08
Electronics360
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2026-06-08
simplywall.st
2026-06-08
simplywall.st
United States/Auto/NasdaqGS:TSLA
Latest News In Electric Vehicles - Innovative Tool Enhances Design Efficiency for Onsemi Solutions
June 08, 2026
Simply Wall St
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onsemi has unveiled its Elite Pairing Studio, an innovative online design tool aimed at optimizing power electronics applications, including those used in electric vehicles. This first-of-its-kind platform facilitates the
2026-06-08
digitimes.com
2026-06-08
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.