Semiconductor News & Analysis Feed
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2026-09-26
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2026-09-23
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2026-09-22
www.digitimes.com
2026-09-22
The groundbreaking of Taiwan's first advanced packaging supply-chain cluster in Kaohsiung, jointly initiated by TSMC and ASE, marks a pivotal strategic move in the global semiconductor landscape. Driven by surging demand from AI accelerators and high-performance computing workloads, the cluster repr
2026-09-22
www.digitimes.com
2026-09-22
China's silicon carbide (SiC) market is experiencing a notable capacity crunch, with demand outpacing domestic production and forcing a spillover of orders to Taiwanese foundries. According to an exclusive Digitimes report, the primary demand drivers are the rapid expansion of high-voltage charging
2026-09-22
www.digitimes.com
2026-09-22
China's silicon carbide (SiC) market is undergoing a significant demand-supply imbalance, with end-market pull from high-voltage EV charging infrastructure and AI data center power systems outpacing domestic manufacturing capacity. According to an exclusive Digitimes report, the resulting capacity c
2026-09-22
news.google.com
2026-09-22
2026-09-22
www.digitimes.com
2026-09-22
GUC's 16 Gbps HBM4E IP on TSMC's N2P node marks a pivotal step in the HBM interface IP ecosystem, signaling that memory bandwidth scaling is now tightly coupled with leading-edge logic processes and advanced packaging. The jump from 12 Gbps on N3P to 16 Gbps on N2P underscores how quickly the HBM ro
2026-09-21
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2026-09-21
2026-09-21
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2026-09-21