TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung - digitimes

www.digitimes.com 2026-09-22 digitimes

Entities

Companies:TSMC ASE

Technologies:Advanced Packaging CoWoS 2.5D/3D Packaging AI HPC Wafer-Level Packaging

Tags

Advanced Packaging TSMC ASE Kaohsiung AI Chips HPC Supply Chain Cluster Semiconductor Manufacturing CoWoS 2.5D Packaging Chip Packaging Taiwan Semiconductor Industrial Park Semiconductor Investment Post-Dennard Scaling

News Summary

The groundbreaking of Taiwan's first advanced packaging supply-chain cluster in Kaohsiung, jointly initiated by TSMC and ASE, marks a pivotal strategic move in the global semiconductor landscape. Driv... Read original →

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