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The IC-Link–TSMC 3DFabric Alliance partnership marks a structural shift in how European fabless design teams access advanced packaging. By becoming the first European-headquartered ASIC partner to simultaneously hold all three OIP alliance memberships, IC-Link collapses the traditional sequential ha

IC-Link, a subsidiary of imec, has joined TSMC’s 3DFabric Alliance, marking a deepening collaboration in advanced packaging technologies. The alliance supports the development and adoption of 2.5D and 3D packaging techniques such as SoIC, CoWoS, and InFO, which are essential for meeting the growing