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2026-07-08
'World's Largest' Smart Power Semiconductor Fab Opens - Design and Development Today
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www.designdevelopmenttoday.com 2026-07-08 Design and Development Today
2026-07-07
EDA giant shifts strategy! Synopsys reportedly halts development of critical wafer manufacturing software, reallocating resources to high-margin businesses such as AI chip design. - 富途牛牛
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news.futunn.com 2026-07-07 富途牛牛
2026-07-07
Nvidia stock slips after report says DeepSeek is designing its own AI chip - Investing.com Nigeria
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ng.investing.com 2026-07-07 Investing.com Nigeria
2026-07-07
Synopsys Inc. focuses on chip design tools as investors watch long-term growth - AD HOC NEWS
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www.ad-hoc-news.de 2026-07-07 AD HOC NEWS
2026-07-07
Synopsys to phase out chip manufacturing software as AI design becomes strategic focus (SNPS) - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Modder builds 8,192-core GPU at home out of RISC-V microcontrollers
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tomshardware.com 2026-07-07 Bruno Ferreira
Well-known engineer Matthias Balwierz (aka Bitluni) designed and created an 8,192-core RISC-V GPU at home.
RISC-VmicrocontrollerGPUopen-source hardwareDIY projecthardware hackerembedded systems3D printing
2026-07-07
US-based Cerebras engages SkyeChip for AI chip design work - KLSE Screener
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www.klsescreener.com 2026-07-07 KLSE Screener
2026-07-07
US-based Cerebras engages SkyeChip for AI chip design work - The Edge Malaysia
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theedgemalaysia.com 2026-07-07 The Edge Malaysia
2026-07-07
Synopsys to Retire Legacy Manufacturing Software, Doubles Down on AI Chip Design - Electronics For You BUSINESS
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www.electronicsforyou.biz 2026-07-07 Electronics For You BUSINESS
2026-07-07
Reuters: Synopsys discontinues certain legacy EDA software to reallocate resources toward higher-margin product lines such as AI-driven design tools. - 富途牛牛
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news.futunn.com 2026-07-07 富途牛牛
2026-07-07
Reuters: Synopsys halts production of certain legacy EDA software to shift focus toward higher-margin product lines such as AI-driven design tools. - 富途牛牛
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news.futunn.com 2026-07-07 富途牛牛
2026-07-07
Synopsys to cut chip fab manufacturing control software in shift to AI design - The Economic Times
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economictimes.indiatimes.com 2026-07-07 The Economic Times
2026-07-07
Cadence Design Systems outlines long-term growth drivers as digital design demand expands - AD HOC NEWS
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www.ad-hoc-news.de 2026-07-07 AD HOC NEWS
2026-07-07
Synopsys to cut chip fab manufacturing control software in shift to AI design, sources say - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Synopsys to cut chip fab manufacturing control software in shift to AI design, sources say - Reuters
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www.reuters.com 2026-07-07 Reuters
2026-07-07
Synopsys to cut chip fab manufacturing control software in shift to AI design, sources say - marketscreener.com
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www.marketscreener.com 2026-07-07 marketscreener.com
2026-07-07
Synopsys Is Phasing Out Fab Software To Focus On AI Design - Finimize
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finimize.com 2026-07-07 Finimize
2026-07-07
TSMC Adds PCB Design Firm for First Time; Cadence's Dual Acquisitions Expose New Frontiers in AI Chip Competition - finance.biggo.com
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finance.biggo.com 2026-07-07 finance.biggo.com
2026-07-07
AI server demand tightens power device supply as lead times stretch to 270 days
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digitimes.com 2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-07
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
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digitimes.com 2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip