Semiconductor News & Analysis Feed
87 articles
2026-05-29
www.tradingview.com
2026-05-29
TradingView
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
eetimes.com
2026-05-28
“Can Europe realistically compete on leading-edge fabs alone?” Maria Marced said. “No.”
2026-05-28
news.google.com
2026-05-28
EE Times
2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
semiengineering.com
2026-05-28
Semiconductor Engineering
Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?
Despite initial design and verification challenges, chiplet-based architectures are proving to be a cost-effective way of reusing large portions of a design while staying current with the latest I/O protocols and logic.
Early discussions about chiplets
2026-05-28
semiengineering.com
2026-05-28
Semiconductor Engineering
Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has effectively acknowledged: incremental chip scaling can no longer keep pace with what AI infrastructure demands. Radical approaches are earning serious consideration and serious capital.
Cerebras’ approach is
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
semiengineering.com
2026-05-28
Liz Allan
Multi-die assemblies give chip architects the option to change some dies while keeping ...
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:33 AM EDT
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SAMSUNG.COM
Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:33 AM EDT
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SAMSUNG.COM
Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals
2026-05-27
sammyguru.com
2026-05-27
SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-26
www.digitimes.com
2026-05-26
digitimes
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2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly t
2026-05-26
semiengineering.com
2026-05-26
Semiconductor Engineering
Researchers from Grenoble INP – UGA, CNRS, TIMA have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”.
Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and performance, t
2026-05-25
finance.yahoo.com
2026-05-25
Yahoo Finance
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2026-05-25
cybernews.com
2026-05-25
Cybernews
cybernews.com
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2026-05-21
www.techpowerup.com
2026-05-21
TechPowerUp
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2026-05-21
www.openpr.com
2026-05-21
openPR.com
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2026-05-21
semiengineering.com
2026-05-21
Semiconductor Engineering
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