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Samsung Electronics is narrowing the gap with market leader SK Hynix in the high-bandwidth memory (HBM) sector, as evidenced by Counterpoint Research data showing Samsung's HBM revenue share rising to 33% in Q2 2024, up 12 percentage points from the previous quarter. Meanwhile, SK Hynix’s share drop

HBM market Memory semiconductor Samsung Electronics SK Hynix NAND flash Semiconductor industry recovery Memory market landscape Technology product upgrade

Samsung narrows the gap with SK Hynix and captures 33% of the memory chip market - صوت الإمارات

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www.voiceofemirates.com 2026-09-04

Samsung narrows gap with No. 1 SK hynix in HBM market revenue in Q2 - koreajoongangdaily.com

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www.koreajoongangdaily.com 2026-09-03

Samsung narrows gap with SK hynix in HBM market in Q2 - Yonhap News Agency

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en.yna.co.kr 2026-09-03

According to industry data, Samsung Electronics narrowed the gap with market leader SK Hynix in the high bandwidth memory (HBM) chip market in Q2 2026. Counterpoint Research reported that SK Hynix retained its No. 1 position with a 50% revenue share in the April-June period, although this dropped by

HBM chip Semiconductor market Samsung Electronics SK Hynix Memory chip Artificial intelligence Storage memory Chip supply chain

Samsung narrows HBM gap as SK hynix leads global market - CHOSUNBIZ - Chosunbiz

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biz.chosun.com 2026-09-03

According to market research firm Counterpoint Research, Samsung Electronics significantly increased its global high bandwidth memory (HBM) market share in Q2 2026, reaching 33%, up 12 percentage points from 21% in Q1. Despite this, SK Hynix retained the top spot with 50%, down 8 points from Q1’s 58

High Bandwidth Memory HBM Semiconductor Market Samsung Electronics SK Hynix Memory Chip Market Share Technology Competition

EXCLUSIVE: God Bless America ETF Exec Says Nvidia Wins No Matter Who Leads AI Race: 'Pioneers Die With Arrows in Their Backs' - Yahoo Finance

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finance.yahoo.com 2026-08-28

CoWoS Capacity Gap Narrows; TSMC Warns ABF Substrates Will Be the Next Bottleneck in Advanced Packaging - finance.biggo.com

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finance.biggo.com 2026-08-11

At the OCP APAC Summit, TSMC's Vice President of Advanced Packaging Technology and Services, He Jun, revealed that with CoWoS capacity doubling for three consecutive years, supply is now 'very close' to market demand. However, the advanced packaging supply chain bottleneck is shifting from memory to

Advanced Packaging CoWoS TSMC ABF Substrates Semiconductor Supply Chain AI Chips Wafer Foundry Semiconductor Manufacturing

Counterpoint Research: AI demand reshapes the DRAM market pattern in the second quarter of 2026 Samsung returns to the top of the list Micron narrows the gap - webull.com

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news.google.com 2026-08-05

MU, SNDK, DRAM Stocks Advance Premarket: Samsung Reclaims DRAM Lead, Micron Narrows Gap With SK Hynix - Stocktwits

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stocktwits.com 2026-08-04

MU, SNDK, DRAM Stocks Advance Premarket: Samsung Reclaims DRAM Lead, Micron Narrows Gap With SK Hynix - Yahoo Finance

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finance.yahoo.com 2026-08-04

MU, SNDK, DRAM Stocks Advance Premarket: Samsung Reclaims DRAM Lead, Micron Narrows Gap With SK Hynix - Stocktwits

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stocktwits.com 2026-08-04

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