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Samsung narrows HBM gap as SK hynix leads global market - CHOSUNBIZ - Chosunbiz

biz.chosun.com 2026-09-03 Chosunbiz
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Technologies:HBMHBM3EHBM4
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High Bandwidth MemoryHBMSemiconductor MarketSamsung ElectronicsSK HynixMemory ChipMarket ShareTechnology CompetitionSemiconductor IndustryStorage MemoryChip Manufacturing3D Stacking
News Summary
According to market research firm Counterpoint Research, Samsung Electronics significantly increased its global high bandwidth memory (HBM) market share in Q2 2026, reaching 33%, up 12 percentage poin... Read original →
Industry Analysis
The HBM market is undergoing a fundamental shift, with Samsung increasing its global share to 33% in Q2 2026, narrowing the gap with SK Hynix’s 50%. This reflects intensified competition driven by rising demand for high-performance memory in AI and data center applications. Technologically, the transition to HBM4 is imminent, offering a key differentiator for early adopters like Samsung, who are already expanding supply capacity. From a geopolitical standpoint, supply chain resilience is under pressure, especially in Taiwan and Hong Kong, China, where manufacturing and logistics face heightened operational risks. Micron’s decline to third place signals a lag in innovation and production scaling. Over the next 12–24 months, the HBM landscape will be defined by early adoption of HBM4, capacity allocation, and strategic positioning among leading players, with Samsung poised to challenge SK Hynix’s dominance if it maintains its supply edge.
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