Samsung narrows gap with SK hynix in HBM market in Q2 - Yonhap News Agency

According to industry data, Samsung Electronics narrowed the gap with market leader SK Hynix in the high bandwidth memory (HBM) chip market in Q2 2026. Counterpoint Research reported that SK Hynix ret... Read original →

The HBM market is undergoing a fundamental shift, with Samsung narrowing the gap against market leader SK Hynix through increased HBM4 production capacity, signaling strategic positioning in the AI compute supply chain. Technologically, while HBM3E dominates current revenue, the ramp-up of HBM4 will drive a leap in data center memory bandwidth, accelerating upstream advancements in EUV lithography and advanced packaging. From a compliance standpoint, geopolitical tensions are intensifying supply chain risks, particularly in manufacturing segments involving Taiwan, China and Hong Kong, China, compelling firms to diversify and localize operations. In competitive dynamics, Micron’s declining share may prompt strategic alliances or M&A moves to regain ground. Over the next 12–24 months, sustained demand for high-bandwidth memory in AI applications will likely propel Samsung to surpass SK Hynix in this niche, reinforcing its dominance in high-performance computing chips globally.