Industry Analysis
The HBM market is undergoing a fundamental shift, with Samsung Electronics gaining ground on market leader SK Hynix, now holding 33% of the market share, up 12 points from Q1 2024. This reflects stronger shipments of its latest HBM3E products to global tech firms, signaling a growing demand for high-bandwidth memory in AI and data center applications. SK Hynix’s share dropped to 50%, narrowing the gap from 37 to 17 percentage points. Concurrently, NAND flash is showing signs of recovery, with global revenue up 70% quarter-over-quarter and average prices surging 55%. Samsung and SK Hynix maintain top positions with 28% and 19% shares respectively. The upcoming ramp of HBM4 in the second half of 2024 is expected to further intensify competition. Supply chain risks, especially amid geopolitical tensions, are pushing companies toward localized and diversified sourcing strategies. Market dynamics suggest both firms may increase R&D investments to secure technological dominance, particularly in advanced packaging and materials. The HBM market is projected to mature by 2025, while NAND price volatility may persist through mid-2025, driven by global AI infrastructure expansion and data center growth.
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