Semiconductor News & Analysis Feed
15 articles
2026-08-15
tomshardware.com
2026-08-15
AMD recently launched the Ryzen 7 7700X3D, an entry-level product in its X3D lineup designed to offer more cost-effective 3D V-Cache solutions. Built on the same Zen 4 architecture and TSMC N5 process as the Ryzen 7 7800X3D, the 7700X3D features lower base and boost clocks, making it more affordable
2026-08-09
tomshardware.com
2026-08-09
In the increasingly competitive mid-range CPU market, Intel and AMD have launched their latest processors, sparking a highly anticipated showdown. The Intel Core Ultra 7 270K Plus, based on the Arrow Lake Refresh architecture and built using TSMC's 3nm process, features 24 cores (8 P-cores and 16 E-
2026-07-19
tomshardware.com
2026-07-19
AMD recently launched the Ryzen 7 7700X3D processor, which received widespread acclaim for its gaming performance, though its $329 price point was seen as less compelling. The chip is nearly identical to the more expensive Ryzen 7 7800X3D, differing mainly in boost clocks and pricing. However, a pro
2026-07-17
tomshardware.com
2026-07-17
AMD unveiled the new Ryzen 7 7700X3D processor at Computex 2026, positioned between the 7600X3D and 7800X3D in its X3D lineup, priced at $329. Notably, it is exclusively available on Newegg in North America until Q3 2026, highlighting AMD's strategic channel control. While the 7700X3D delivers stron
2026-06-26
tomshardware.com
2026-06-26
This article provides an in-depth analysis of the performance battle between AMD's Ryzen 7 5800X3D and Intel's Core i7-14700K, focusing on the competition for DDR4 supremacy in 2026. The Ryzen 7 5800X3D, based on the Zen 3 architecture, leverages innovative 3D V-Cache technology to deliver strong ga
2026-06-26
tomshardware.com
2026-06-26
AMD's latest Ryzen 7 5800X3D 10th Anniversary Edition has sparked market attention due to its re-engineered bonding process, offering slight performance improvements over the original. While the official MSRP is $350, scalpers are already listing the chip for $600 or more on secondhand platforms, wi
2026-06-01
tomshardware.com
2026-06-01
AMD has launched two X3D CPUs to address rising component costs in the current market. The Ryzen 7 5800X3D 10th Anniversary Edition, priced at $349, is $100 cheaper than its predecessor launched over four years ago. It features the first-generation 3D V-Cache technology with 8 Zen 3 cores and 16 thr
2026-05-30
www.tomshardware.com
2026-05-30
In the midst of current turbulence in the PC hardware market, Newegg has launched an attractive hardware bundle featuring the AMD Ryzen 7 5800X processor paired with NVIDIA's RTX 5060 GPU at just $439, saving $150 compared to the original price. The deal also includes a free Gamdias BOREAS M2-510WH
2026-05-26
www.tweaktown.com
2026-05-26
According to Taiwanese supply chain sources, AMD's next-generation Zen 7 processor, codenamed 'Grimlock,' is reportedly set to be manufactured using TSMC's 1.4nm A14 process node, bypassing intermediate nodes such as N2P, N2X, and A16. This move positions the Zen 7 architecture for a launch window a
2026-05-25
www.techpowerup.com
2026-05-25
AMD's next-generation Zen 7 processor will utilize TSMC's A14 process node, representing the cutting edge of semiconductor manufacturing technology. This advancement offers significant improvements in performance, power efficiency, and die area compared to previous generations. The integration of mo
2026-05-25
www.techpowerup.com
2026-05-25
2026-05-25
overclock3d.net
2026-05-25
Recent reports from the Taiwan Commercial Times indicate that AMD plans to use TSMC's A14 (1.4nm) process node for its upcoming Zen 7 processors, codenamed 'Grimlock', with trial production expected in 2027 and mass production in 2028. AMD is skipping intermediate nodes such as N2P, N2X, and A16, di
2026-05-25
videocardz.com
2026-05-25
2026-05-25
wccftech.com
2026-05-25
According to a report by the Taiwan Commercial Times, AMD’s next-generation x86 CPU architecture, Zen 7 (codename Grimlock), is expected to leverage TSMC’s A14 1.4nm process technology and advanced FOPLP packaging. The processor is anticipated to launch in 2028, underscoring AMD’s continued push int
2026-05-25
www.trendforce.com
2026-05-25
According to reports from Commercial Times and TweakTown, AMD’s next-generation Zen 7 processor is expected to be manufactured using TSMC’s A14 process node, with Powertech Technology’s fan-out panel-level packaging (FOPLP) under evaluation. This development underscores AMD’s pursuit of advanced man