Semiconductor News & Analysis Feed
41 articles
2026-07-06
news.google.com
2026-07-06
TrendForce
2026-07-06
news.google.com
2026-07-06
TrendForce
2026-07-04
tomshardware.com
2026-07-04
Etiido Uko
TrendForce says DRAM and NAND prices will continue to rise through Q3 2026, but AI-driven gains are slowing as PC and smartphone makers reach their affordability limits.
2026-07-02
www.trendforce.com
2026-07-02
TrendForce
[News] SK hynix Reportedly Removes Price Cap in Memory Long-Term Agreements, Diverging from Micron
2026-07-02 Semiconductors editor
News
Please note that this article cites information from Green Economy News, Busan Ilbo, ZDNet and Reuters.
As Micron announced another major Strategic Customer Agreement (SCA) with General Motors, the structure of global memory makers’ long-term supply agr
2026-07-02
www.trendforce.com
2026-07-02
TrendForce
2026-07-02
www.trendforce.com
2026-07-02
TrendForce
2026-07-01
www.trendforce.com
2026-07-01
TrendForce
[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike
2026-07-01 Semiconductors editor
News
Please note that this article cites information from MoneyDJ, Liberty Times, and Economic Daily News.
AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing indust
2026-07-01
www.trendforce.com
2026-07-01
TrendForce
[News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity
2026-07-01 Semiconductors editor
News
Please note that this article cites information from Wccftech, Tom’s Hardware, San Francisco Business Times and CNBC.
As interest in Intel’s foundry services continues to grow among a broader range of tech giants like Apple and NVIDIA, the chipmaker is accel
2026-06-30
www.trendforce.com
2026-06-30
TrendForce
[News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel
2026-06-30 Semiconductors editor
News
Please note that this article cites information from The Elec, Chosun Biz, and Economic Daily News.
The global semiconductor industry is set to enter a new Warring States era, as Samsung Electronics and SK hynix unveiled a sweeping in
2026-06-29
www.trendforce.com
2026-06-29
TrendForce
[News] Samsung, SK hynix, Micron Face U.S. Class-Action Lawsuit Over Alleged DRAM Supply Manipulation
2026-06-29 Semiconductors editor
News
Please note that this article cites information from IT Chosun, Wccftech, and The Biz.
The world’s three largest memory chipmakers—Samsung, SK hynix, and Micron—are facing a U.S. class-action lawsuit. According to IT Chosun, 17 U.S. consumers allege
2026-06-22
www.trendforce.com
2026-06-22
TrendForce
[News] TSMC Reportedly Cuts 28nm Output by Over 25% Since Early 2026 as Advanced Node Push Accelerates
2026-06-22 Semiconductors editor
News
Please note that this article cites information from Commercial Times and Economic Daily News.
As TSMC ramps up 2nm and 3nm production, it is also accelerating the phaseout of legacy nodes. Commercial Times, citing supply chain sources, reports that
2026-06-22
www.trendforce.com
2026-06-22
TrendForce
[News] Micron Earnings Preview: Four Key Areas in Focus — HBM Progress, Capex and More
2026-06-22 Semiconductors editor
News
Please note that this article cites information from Reuters, Investing.com, Bloomberg, STOCK Analysis and The Elec.
As Micron prepares to report its fiscal third-quarter results on June 24, investor attention is turning to whether its strong earnings and elevated
2026-06-22
www.trendforce.com
2026-06-22
TrendForce
[News] MIT Announced Breakthrough in GaN-on-Single-Crystal Diamond Thermal Management Technology
2026-06-22 Semiconductors editor
News
On June 8, 2026, the Massachusetts Institute of Technology (MIT) announced that its researchers had successfully embedded gallium nitride (GaN) transistors into an ultra-thin single-crystal diamond layer, overcoming a major thermal bottleneck in high-power
2026-06-19
www.trendforce.com
2026-06-19
TrendForce
[News] World’s First Mass-Produced GaN-on-Silicon RF Chip for Smart Terminals Surpasses 5 Million Units Shipped
2026-06-19 Semiconductors editor
News
Please note that this article cites information from Science and Technology Daily.
As per Science and Technology Daily, the first gallium nitride-on-silicon (GaN-on-Si) radio frequency (RF) chip for smart terminals to enter mass production
2026-06-17
www.trendforce.com
2026-06-17
TrendForce
[News] TSMC, Amkor Sign 10-Year Arizona Advanced Packaging Pact to Complete the U.S. Chip Supply Chain
2026-06-17 Semiconductors editor
News
Please note that this article cites information from Amkor, ESM China, and Reuters.
TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties h
2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Economic Daily News, Reuters. and Commercial Times.
TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Dail
2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] Infineon Found to Infringe Innoscience GaN Patent, Barred from Selling Certain Products in China
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Innoscience.
Innoscience announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bring
2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June–July Shipments to Key Customers
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Newsis, The Chosun Daily and Yonhap News.
Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdr
2026-06-12
www.trendforce.com
2026-06-12
TrendForce
[News] NVIDIA Reportedly Opens Vera CPU Sales to China as Early as August as H200 Shipments Stall
2026-06-12 Semiconductors editor
News
Please note that this article cites information from Reuters, Tom’s Hardware, and Nikkei.
While NVIDIA continues to face hurdles in shipping its H200 AI accelerators to China, the company may be opening a new channel into the market. According to Reuters
2026-06-12
www.trendforce.com
2026-06-12
TrendForce
[News] Samsung Reportedly in Talks for Google 2nm TPU I/O Die Order; 2028 Mass Production Eyed
2026-06-12 Semiconductors editor
News
Please note that this article cites information from Business Korea, The Information, Reuters, The Korea Herald, and ETNews.
Google is reportedly considering Samsung for part of its next-generation AI processor production. According to Business Korea, citin