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Tech Industry Manufacturing Semiconductors Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer News-analysis By Luke James published June 19, 2026 EUV-printed 28nm gates and 94% working devices, all on standard production tooling. (Imag

Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.

As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.