Semiconductor News & Analysis Feed
177 articles
2026-06-29
digitimes.com
2026-06-29
China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyo
2026-06-29
digitimes.com
2026-06-29
BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's push to extend vertical integration from electrification into intelligent driving.
2026-06-29
simplywall.st
2026-06-29
simplywall.st
United States/Software/NasdaqGS:SNPS
Is Synopsys’ AI-Enabled Ansys Integration Reshaping The Investment Case For Synopsys (SNPS)?
June 29, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Earlier in June 2026, Synopsys launched its first AI-enabled Multiphysics Fusion solutions, integrating its EDA tools with Ansys “golden signoff” analysis to accelerate chip timing signoff, design closure, and mul
2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-27
finance.yahoo.com
2026-06-27
Yahoo Finance
Nvidia (NVDA) Launches BioNeMo Toolkit As Life Sciences Groups Rush To Integrate It
Bailey Pemberton
Fri, June 26, 2026 at 12:07 PM PDT 2 min read
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2026-06-26
eetimes.com
2026-06-26
Two new security chips aim to future-proof devices for the quantum era by integrating hardware accelerators that support PQC algorithms.
2026-06-26
digitimes.com
2026-06-26
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array
2026-06-25
clpmag.com
2026-06-25
Clinical Lab Products
Tecan and NVIDIA Integrate New Artificial Intelligence Capabilities into Lab Analytics Platform
Jun 25, 2026 | Analytical Software Systems, Company News, Lab Automation |
The update to the Introspect platform aims to help clinical laboratories move toward proactive operations and improved productivity.
Tecan, a provider of laboratory automation and solutions, announced the integration of a
2026-06-25
simplywall.st
2026-06-25
simplywall.st
United States/Semiconductors/NasdaqGS:NVDA
Nvidia (NVDA) Launches BioNeMo As Life Sciences Firms Roll Out Integrations
June 25, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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NVIDIA (NasdaqGS:NVDA) launched its BioNeMo Agent Toolkit this week, a domain-focused AI platform for life sciences research.
The toolkit is designed for AI agents and scientific teams to automate, reason, a
2026-06-25
www.channelnewsasia.com
2026-06-25
CNA
Singapore
Singapore looks to upgrade PayNow with reduced payment steps, integration with NETS QR
A pilot scheme to be rolled out by end-2026 will allow customers using a PayNow-enabled app to pay merchants who display a NETS QR code.
Deputy Prime Minister and Chairman for the Monetary Authority of Singapore Gan Kim Yong speaking at the ABS' 53rd Annual Dinner, Jun 25, 2026. (Photo: CNA/Wallace
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand driven by semiconductor capacity expansion. Together with its subsidiaries Han-Yang Technology Renewable Energy and Sunlight Environment, the company has a combined annual treatment capacity of 239,000 tons.
2026-06-24
thequantuminsider.com
2026-06-24
The Quantum Insider
PRESS RELEASE — The Eclipse Qrisp developer community has integrated Eclipse Qrisp – the open-source framework for quantum programming initiated by Fraunhofer FOKUS – with the NVIDIA CUDA-Q platform for hybrid quantum-classical computing. The integration will be made publicly available later this year.
The integration enables a straightforward workflow: developers write quantum programmes in Qris
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
www.hpcwire.com
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2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
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2026-06-24
digitimes.com
2026-06-24
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.
2026-06-23
thequantuminsider.com
2026-06-23
The Quantum Insider
PRESS RELEASE — Quandela today announced that it has experimentally validated a low-latency integration path between photonic quantum processors and NVIDIA AI infrastructure, marking an important milestone toward bringing quantum processing units directly into high-performance computing environments. Results presented at ISC 2026 demonstrate a path toward accelerator-style integration of photon
2026-06-23
eetimes.com
2026-06-23
AI's growth is hitting an architectural wall, not just compute—discover why integration trumps raw power in this exclusive interview.
2026-06-23
www.semiconductor-today.com
2026-06-23
Semiconductor Today
ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors
In partnership with equipment provider Advanced Semiconductor Materials Lithography (ASML) of Veldhoven, The Netherlands and foundry Taiwan Semiconductor Manufacturing Corp (TSMC), nanoelectronics research center imec of Leuven, Belgium has presented a novel, robust and scalable 300mm integration
2026-06-22
www.semiconductor-today.com
2026-06-22
Semiconductor Today
Two researchers at China’s Shandong University have reported monolithic integration (Figure 1) of all-gallium nitride (GaN) circuits consisting of 2 transistors (2T), 1 capacitor (1C), a micro-light-emitting diode (μLED) and a photodetector (PD) [Yipin Gao and Chao Liu, ACS Photonics, published online 22 May 2026].
Figure 1: (a) Schematic, (b) equivalent circuit, and (c) microscope image of monol