Semiconductor News & Analysis Feed
10621 articles
2026-07-14
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2026-07-14
TrendForce
2026-07-14
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2026-07-14
Investing.com
2026-07-14
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2026-07-14
Investing.com
2026-07-14
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2026-07-14
Financial Times
2026-07-14
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2026-07-14
Financial Times
2026-07-14
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2026-07-14
digitimes
2026-07-14
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2026-07-14
digitimes
2026-07-14
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2026-07-14
Wccftech
2026-07-14
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2026-07-14
digitimes
2026-07-14
digitimes.com
2026-07-14
Liying said revenue reached a quarterly record of NT$108 million in the second quarter of 2026, crossing the NT$100 million (US$3.11 million) mark for the first time as strong demand for AI chips kept semiconductor utilization rates high. The company also reported record first-half revenue of NT$206 million, reflecting continued demand for its circular-economy services tied to waste hydrofluoric a
2026-07-14
digitimes.com
2026-07-14
Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping far larger fab projects in Germany and Poland. The move signals that, under a turnaround intended to align capacity with real demand, the chipmaker sees consolidated, upgraded capacity in a proven site — rather than
2026-07-14
digitimes.com
2026-07-14
China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx. US$110.62 million) to CNY850 million, up 231.16% to 275.31% from CNY226 million a year earlier, according to a forecast filed with the Shenzhen Stock Exchange. Diluted earnings per share are seen at CNY0.2290-0.25
2026-07-14
digitimes.com
2026-07-14
United Microelectronics Corp (UMC) is moving into silicon photonics, positioning itself to address one of the defining bottlenecks in artificial-intelligence data centers: the speed at which chips can talk to one another. In doing so, the mature-node specialist is turning Singapore into a manufacturing base for a technology that uses light rather than electrical signals to move data across AI clus
2026-07-14
digitimes.com
2026-07-14
US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.
2026-07-14
digitimes.com
2026-07-14
Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking a shift from laboratory research to engineering validation, small-batch tape-outs and early industrialisation.
2026-07-14
digitimes.com
2026-07-14
AI computing demand continues to fuel growth in the global memory market, but the industry's attention is shifting beyond short-term price movements. Increasingly, the focus is on longer-term variables, including the pace of capacity expansion, the sustainability of AI-driven demand, and whether emerging AI applications can achieve commercial scale.
2026-07-14
digitimes.com
2026-07-14
Trusval Technology posted record revenue in the second quarter and first half of 2026, supported by demand tied to global AI infrastructure buildouts and continued expansion of advanced process and advanced packaging capacity by semiconductor makers. The company said order visibility has now extended through 2027.
2026-07-14
digitimes.com
2026-07-14
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing. The latest sales data suggest the upgrade cycle is broadening beyond one segment, with advanced ABF substrates and high-end CCL benefiting from higher specifications, better pricing, and rising AI content. For inves
2026-07-14
digitimes.com
2026-07-14
Nvidia has removed more than half of the Asian customers it previously authorized to buy its advanced chips, after creating a new internal white list intended to prevent the processors from reaching China through other countries. The Financial Timesreported the move, citing three people familiar with the matter.
2026-07-14
digitimes.com
2026-07-14
Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou