Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel

Trump’s renewed emphasis on TSMC’s Arizona expansion reveals Washington’s deep anxiety over onshoring advanced nodes. Technically, this accelerates the migration of EUV, advanced packaging, and HBM ecosystems to North America, forcing equipment vendors like Applied Materials to reconfigure service footprints and raising co-design barriers between DRAM and logic chips. Compliance-wise, a rigid push for 50% domestic market share imposes triple costs: redundant capacity, export control compliance upgrades, and geopolitical buffer inventory. Samsung and Intel will likely double down on dual-base strategies across the U.S.-Korea and U.S.-EU corridors, especially in HBM4 and AI accelerators. Over the next 18 months, the real long-tail impact isn’t capacity relocation—it’s the politicization of innovation cycles. While Taiwan, China-based foundries gain short-term subsidies, they risk long-term ‘technological isolation,’ eroding leadership in sub-3nm ecosystem governance.