Trusval sets record first-half revenue as AI factory demand pushes orders to 2027

Trusval’s record revenue reflects structural demand from AI fabs, not a cyclical spike. Technically, this accelerates adoption of high-density interconnects like CoWoS and FOPLP, pressuring materials suppliers to enhance dielectric and thermal performance. On compliance, tightening U.S. export controls compel Trusval to embed geolocation-aware firmware, raising R&D costs by 10–15%. Competitively, Applied Materials and Tokyo Electron may respond with bundled service deals or extended payment terms, especially targeting Southeast Asia’s new wafer fabs. Over the next 12–24 months, extended order visibility into 2027 signals front-loaded capex—but if AI chip yields underperform, a correction in equipment orders looms. The current boom masks significant capacity misallocation risk.