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Trending Technologies
EUV71 3nm60 AI chips26 DRAM24 HBM23 GPU22 AI17 memory chips16 AI accelerators8 semiconductor manufacturing8 DDR58 3D NAND6 NAND6 HBM3E5 semiconductor5
2026-07-16
Japan’s Robotics and Manufacturing Leaders Build on NVIDIA Cosmos to Advance Physical AI Frontier - NVIDIA Newsroom
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nvidianews.nvidia.com 2026-07-16 NVIDIA Newsroom
2026-07-16
Japan’s Robotics Leaders Intend to Join NVIDIA’s Cosmos Coalition - Stock Titan
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news.google.com 2026-07-16 Stock Titan
2026-07-16
Huang Praises SK Hynix Nasdaq Listing - Businesskorea
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www.businesskorea.co.kr 2026-07-16 Businesskorea
2026-07-16
Why is SK Hynix stock plunging today? - Investing.com
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www.investing.com 2026-07-16 Investing.com
2026-07-16
Nvidia doubles down on the land of the rising GPU, wiring Blackwell into Japan's science, banks, factories and cars - digitimes
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www.digitimes.com 2026-07-16 digitimes
2026-07-16
Nvidia doubles down on the land of the rising GPU, wiring Blackwell into Japan's science, banks, factories and cars - digitimes
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www.digitimes.com 2026-07-16 digitimes
2026-07-16
$14M Cash-Secured Put Signals Confidence in TSMC Through Feb 2027 | Options Income Daily - Moomoo
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www.moomoo.com 2026-07-16 Moomoo
2026-07-16
Synopsys stock reflects steady growth prospects in electronic design automation - Ad-hoc-news.de
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www.ad-hoc-news.de 2026-07-16 Ad-hoc-news.de
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
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www.digitimes.com 2026-07-16 digitimes
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
0.95
www.digitimes.com 2026-07-16 digitimes
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO - digitimes
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www.digitimes.com 2026-07-16 digitimes
2026-07-16
Infineon, LS ELECTRIC Partner on DC Power Infrastructure for AI Data Centers - EE Times Asia
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news.google.com 2026-07-16 EE Times Asia
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World?s First Agentic AI Platform for PCB and Advanced Packaging - marketscreener.com
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www.marketscreener.com 2026-07-16 marketscreener.com
2026-07-16
Semiconductor Grade Nmp Market By 2035, Demand to Accelerate on Rising Wafer Starts and Ultra-High-Purity Solvent Requirements - News and Statistics - IndexBox
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www.indexbox.io 2026-07-16 IndexBox
2026-07-16
CXMT's US$8.5 billion IPO signals China's accelerating challenge to global memory leaders
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digitimes.com 2026-07-16
CXMT's Shanghai debut could reshape global memory markets by speeding China's push into advanced DRAM and HBM, while highlighting how US export controls are altering the industry's technology path. For readers worldwide, the listing signals both greater supply competition and a potential shift in where next-generation memory innovation develops.
2026-07-16
ASML signals pricing power and a two-year capacity sprint as AI tightens the lithography bottleneck
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digitimes.com 2026-07-16
During the question-and-answer session of ASML's second-quarter 2026 earnings call on July 15, executives at the world's only maker of extreme ultraviolet (EUV) lithography systems signaled that they now have room to raise prices and are preparing to expand output of their most important machines by roughly 30% in each of the next two years — all without building new cleanrooms. The tone confirmed
2026-07-16
Taiwan power device makers gain from automotive inventory buildup and order shifting
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digitimes.com 2026-07-16
Semiconductor supply chains remain tight, and Taiwan power device suppliers say the automotive market, after two years of inventory digestion, is now building up extra stock to avoid shortages. Rebounding demand from 3C end markets is also expected to support revenue in the second half of 2026.
2026-07-16
Apple reportedly explores AI chip acquisitions as it races to strengthen its infrastructure
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digitimes.com 2026-07-16
Apple is exploring acquisitions of semiconductor companies to accelerate development of AI server chips, reflecting mounting pressure to improve the computing infrastructure behind its AI ambitions, according to The Information.
2026-07-16
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
0.92
digitimes.com 2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate
2026-07-16
Silan Microelectronics forecasts stronger first-half 2026 profit on sales growth and investment gains
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digitimes.com 2026-07-16
Hangzhou Silan Microelectronics said its first-half 2026 profit is set to rise sharply, driven by revenue growth, product upgrades, and fair-value gains on financial assets. The outlook matters for global semiconductor markets because it points to resilient demand across automotive, industrial, and energy applications despite rising costs and competition.