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Trending Companies
TSMC6 Nvidia5 Intel5 AMD5 SK Hynix4 Synopsys4 NVIDIA4 Micron3 Siemens EDA3 Samsung3 OpenAI2 Anthropic2
Trending Technologies
EDA5 HBM4 DRAM3 Agentic AI3 GPU3 Memory Chips2 LLM2 Formal Verification2 Chiplets2 Advanced Packaging2 Blackwell2 RTX 50902
2026-09-17
APD Expands Semiconductor Footprint With $250M Arizona Investment - Yahoo Finance
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finance.yahoo.com 2026-09-17
2026-09-17
APD Expands Semiconductor Footprint With $250M Arizona Investment - TradingView
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www.tradingview.com 2026-09-17
2026-09-12
NVIDIA (NVDA) Expands Its AI Factory Footprint, Is The Stock A Bargain? - simplywall.st
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simplywall.st 2026-09-12
NVIDIA's strategic expansion of its AI factory footprint represents a significant move in the rapidly evolving semiconductor landscape. As artificial intelligence continues to permeate various industries, NVIDIA's enhanced manufacturing capabilities position the company to meet surging demand for co
NVIDIAAI chipsSemiconductor manufacturingArtificial intelligenceGPUData centerAI factorySemiconductor industry
2026-09-07
Nvidia’s Israeli networking business is booming, and so is its economic footprint - calcalistech.com
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www.calcalistech.com 2026-09-07
2026-08-28
Nvidia launches corporate PAC, expanding Washington footprint - The Hill
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news.google.com 2026-08-28
2026-08-27
SK Hynix Breaks Ground on Indiana HBM Base — A Footprint the Size of 75 Soccer Fields - finance.biggo.com
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finance.biggo.com 2026-08-27
SK Hynix has officially initiated construction of its advanced packaging production facility in West Lafayette, Indiana, marking a significant step in its U.S. semiconductor strategy. The $3.87 billion investment, set to begin mass production of high-bandwidth memory (HBM) and AI-related memory prod
Semiconductor ManufacturingMemory ChipsHBMAI ChipsU.S. InvestmentSupply ChainKorea-US CooperationWafer Fab Construction
2026-08-24
Arizona’s chip footprint grows, but TSMC’s water demand sparks questions - AZ Family
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www.azfamily.com 2026-08-24
2026-08-21
GaN 40-V Switches Reduce Footprint by 82% for Portable Power Designs - Electronic Design
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www.electronicdesign.com 2026-08-21
2026-08-11
FAPlace: Footprint-Aware Chiplet Placement for 2.5D Systems | A*STAR Research - News and Statistics - IndexBox
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news.google.com 2026-08-11
2026-08-11
Optimizing Chiplet Placement And Interposer Footprint For 2.5D Systems (A*STAR) - Semiconductor Engineering
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news.google.com 2026-08-11
2026-08-07
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push - digitimes
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news.google.com 2026-08-07
2026-08-07
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
0.92
digitimes.com 2026-08-07
2026-07-29
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics - Morningstar
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news.google.com 2026-07-29
2026-07-28
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics - PR Newswire
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news.google.com 2026-07-28
2026-07-20
BMS expands AI footprint with Nvidia, aiming for ‘most powerful AI factory in life sciences’ - Fierce Biotech
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www.fiercebiotech.com 2026-07-20
2026-07-10
LG Innotek expands Vietnam footprint with new IC substrate plant
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digitimes.com 2026-07-10
2026-07-07
Micron’s Boise footprint grows as chipmaker asks city to annex another 240 acres - Idaho Statesman
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news.google.com 2026-07-07
2026-07-04
Texas Instruments expands its chip footprint as demand for analog and embedded solutions stays resil - Ad-hoc-news.de
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www.ad-hoc-news.de 2026-07-04
Texas Instruments (TI), a leading global semiconductor company, is expanding its market footprint through a diversified portfolio of analog and embedded chips, leveraging resilient demand across automotive, industrial, and communications sectors. TI's analog chips, which manage power and interface b
Texas InstrumentsAnalog ChipsEmbedded ProcessorsAutomotive ElectronicsIndustrial AutomationPower Management ICsSemiconductor IndustrySupply Chain Control
2026-07-01
HBM Shortages Push AMD To Roll Out Its First Memory On-Package SoC, Meet Versal Gen 2 With 60% Less Board Footprint, 10x Compute & PCIe6 Support - Wccftech
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wccftech.com 2026-07-01
AMD's launch of the Versal Gen 2, its first System-on-Chip (SoC) with on-package memory, addresses the ongoing global DRAM shortage and soaring HBM prices. The chip integrates up to 32GB of LPDDR5X memory, delivering up to 288GB/s bandwidth while reducing board footprint by 60%. It offers a 10x comp
AMDVersal Gen 2SoCMemory on PackageLPDDR5XHBM shortageCompute upliftBoard footprint reduction
2026-06-30
Infineon introduces 120V common-footprint gate driver for silicon and GaN power designs on the same PCB - Semiconductor Today
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www.semiconductor-today.com 2026-06-30