Semiconductor News & Analysis Feed
1282 articles
2026-06-11
digitimes.com
2026-06-11
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
2026-06-11
digitimes.com
2026-06-11
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.
2026-06-11
digitimes.com
2026-06-11
Andy Hock, chief strategy officer at Cerebras Systems, walked onto the Main Stage at SuperAI Singapore 2026 on Wednesday carrying the company's Wafer Scale Engine — the physical chip itself — and held it up for an audience of 10,000 before placing it next to a slide showing it to scale against Nvidia's latest B200 platform. The size difference was stark.
2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
Amazon Is the Latest AI Giant to Sign a Blockbuster Deal With This Under-the-Radar Semiconductor Company (Behind Nvidia and Meta)
Anthony Di Pizio, The Motley Fool
Wed, June 10, 2026 at 3:50 PM PDT 5 min read
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2026-06-11
www.fool.com
2026-06-11
The Motley Fool
Corning (
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) has manufactured glass right here in America since 1851. By 1880, it was the sole supplier of glass for Thomas Edison's original lightbulb, and today, it makes the glass for all of Apple's iPhones.
However, Corning stock has soared by 230% over the past 12 months because of red-hot demand for the company's fiber-optic cables for data centers, which help accelerate processing
2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
Teradyne And Tokyo Electron Target AI Chiplet Test As Adoption Watchpoint
Simply Wall St
Wed, June 10, 2026 at 3:14 PM PDT 4 min read
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Teradyne (NasdaqGS:TER) has introduced a new integrated test solution for AI and data cent
2026-06-11
www.digitimes.com
2026-06-11
digitimes
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
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2026-06-11
www.investing.com
2026-06-11
Investing.com
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2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
Intel’s Google AI Chip Win Tests Foundry Turnaround And Nvidia Trials
Simply Wall St
Wed, June 10, 2026 at 11:11 AM PDT 5 min read
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Google has selected Intel to manufacture mo
2026-06-11
www.automotivetestingtechnologyinternational.com
2026-06-11
Automotive Testing Technology International
Texas Instruments (TI) has launched a high-cell-count battery monitor with an integrated electrochemical impedance spectroscopy (EIS) engine, bringing predictive intelligence, comprehensive data and real-time diagnostics to battery monitoring in electric vehicles and energy storage system applications.
The BQ79826Z-Q1 battery monitor enhances safety and extends battery life by detecting potential
2026-06-11
blogs.nvidia.com
2026-06-11
NVIDIA Blog
NVIDIA Accelerates Google DeepMind’s DiffusionGemma for Local AI
The new Diffusion Gemma open model generates text in parallel — not one token at a time — and is optimized to run on the NVIDIA RTX PRO platform, NVIDIA DGX Spark systems and GeForce RTX GPUs.
June 10, 2026 by Michael Fukuyama
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Today, Google DeepMind released DiffusionGemma — an experimental open model built for exceptional
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
When you purchase through links on our site, we may earn an affiliate commission. Here’s how
2026-06-10
quantumzeitgeist.com
2026-06-10
Quantum Zeitgeist
HIGH PERFORMANCE COMPUTING, DEEP TECH
Multi-Year Cadence Deal Accelerates Intel 14A Time-to-Market
June 10, 2026
BY RUSTY FLINT
Cadence and Intel Foundry have launched a multi-year collaboration targeting Intel’s 14A process technology, an effort to bolster Intel’s position in advanced chip manufacturing. The expanded cooperation will center on Design Technology Co-Optimization, leveraging Cadenc
2026-06-10
eetimes.com
2026-06-10
As AI models scale to trillions of parameters, conventional memory architectures face mounting capacity and efficiency constraints.
2026-06-10
www.investing.com
2026-06-10
Investing.com
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2026-06-10
news.google.com
2026-06-10
CNBC
2026-06-10
finance.yahoo.com
2026-06-10
Yahoo Finance
Scott Galloway Says Tesla, Nvidia, Broadcom Could Get Caught In The Crossfire Of The Space X IPO
Daragh Thomas
Wed, June 10, 2026 at 2:45 AM PDT 5 min read
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NYU professor Scott Galloway warns a wa
2026-06-10
www.bisinfotech.com
2026-06-10
Bisinfotech
www.bisinfotech.com
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2026-06-10
www.mk.co.kr
2026-06-10
매일경제
사진 확대
"We’ll cover the investment costs, so please secure the substrate supply first."
Competition to secure supply chains in the artificial intelligence (AI) semiconductor market is entering a new phase. Just one or two years ago, High Bandwidth Memory (HBM) was the hardest component to obtain. Concerns then shifted to shortages of general-purpose DRAM and NAND flash memory, and now semiconducto
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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