Semiconductor News & Analysis Feed
2174 articles
2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.gurufocus.com
2026-05-27
GuruFocus
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.stocktitan.net
2026-05-27
Stock Titan
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
eetimes.com
2026-05-27
The most important takeaway everyone missed at the 2026 Google I/O Conference.
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.ibtimes.com
2026-05-27
International Business Times
By
Merin Rebecca Thomas
Published 05/26/26 AT 5:55 PM EDT
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ByteDance plans to purchase millions of Qualcomm application-specific integrated circuits, or ASICs, to support its AI agent software and broader artificial intelligence operations. AFP
Qualcomm has secured a deal to supply artificial intelligence ch
2026-05-27
mexicobusiness.news
2026-05-27
Mexico Business News
Micron Technology reached a US$1 trillion market valuation for the first time on May 26 after its shares surged nearly 20% during trading, highlighting the growing importance settling up 17.4% at US$881.60, extending a rally that has made Micron one of the semiconductor industry’s strongest performers over the past year.
The increase followed UBS raising its price target on Micron shares from US$
2026-05-27
www.investors.com
2026-05-27
Investor's Business Daily
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2026-05-27
www.ndtv.com
2026-05-27
NDTV
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2026-05-27
www.ndtv.com
2026-05-27
NDTV
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2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
Visit ROHM at booth 318 in hall 9
Demonstrating cutting edge power semiconductor technologies.
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Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
news.samsung.com
2026-05-27
samsung.com
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