Industry Analysis
ROHM’s SiC showcase at PCIM 2026 isn’t just a product display—it’s a strategic response to the global rollout of 800V EV architectures and tightening industrial efficiency mandates. Higher switching frequencies and reduced conduction losses in its modules will accelerate IGBT obsolescence and force upstream upgrades in gate drivers and packaging. While lacking overseas fabs, ROHM mitigates EU Battery Regulation and U.S. IRA risks through deep integration with European Tier 1s. Countering Infineon and STMicro’s vertical SiC advantage, ROHM targets cost-sensitive yet performance-aware OBC makers in Taiwan, China and Southeast Asia with hybrid discrete-module solutions. Within 18 months, as AI server PSU standards tighten, ROHM’s low-parasitic packaging could become a new design anchor—extending its automotive traction into data center power infrastructure.
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