Semiconductor News & Analysis Feed
1411 articles
2026-05-27
www.tradingkey.com
2026-05-27
TradingKey
SK Hynix shares surged over 10%, pushing its market cap past $1 trillion, becoming the third global memory chip company to achieve this. Driven by high-bandwidth memory (HBM) demand for AI servers and its role as a core Nvidia supplier, SK Hynix's stock has gained significantly. Full-year 2026 HBM capacity is sold out, with shortages expected through 2027. Potential labor disruptions at Samsung El
2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
www.chosun.com
2026-05-27
조선일보
By Kwak Chang-yeol
Published 2026.05.27. 09:29
Updated 2026.05.27. 10:19
On May 27, 2026, the KOSPI, which breaks through 8,400 for the first time during trading, is displayed on the status board at Hana Bank's dealing room in Jung-gu, Seoul. On this day, the KOSPI starts at 8,242.12, up 194.61 points (2.42%) from the previous day. /News1
The KOSPI surged over 4% immediately after opening on the
2026-05-27
www.cnbc.com
2026-05-27
CNBC
Shares of SK Hynix jumped more than 11% on Wednesday, lifting the South Korean chipmaker’s market capitalization above $1 trillion as investors continued to pile into artificial intelligence-linked semiconductor stocks.
The rally extended a blistering run that has already seen SK Hynix shares skyrocket about 250% since the start of the year, fueled by surging demand for high-bandwidth memory chip
2026-05-27
www.reuters.com
2026-05-27
Reuters
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2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
digitimes.com
2026-05-27
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con
2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's...
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
www.techspot.com
2026-05-27
TechSpot
www.techspot.com
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2026-05-27
www.thelec.net
2026-05-27
thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix)
SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
www.upi.com
2026-05-27
upi.com
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2026-05-27
www.mk.co.kr
2026-05-27
매일경제
사진 확대
[Photo courtesy of Yonhap News]
SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages.
HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Kwak Chang-yeol,
Yoo Jane
Published 2026.05.27. 00:51
SK Hynix, left, Samsung Electronics headquarters. /Yonhap
The KOSPI closed above the 8,000-point mark for the first time in history.
The KOSPI rose 2.55% from the previous day to 8,047.51 on the 26th, driven by gains of 2.2% and 5.7% in semiconductor "top two" companies Samsung Electronics and SK Hynix, respectively. Earlier, on the 15th
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI