Semiconductor News & Analysis Feed
2532 articles
2026-05-26
www.investing.com
2026-05-26
Investing.com
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2026-05-26
cryptorank.io
2026-05-26
CryptoRank
SK Hynix stock jumped nearly 7% as Nvidia’s blowout quarter (fiscal Q1 revenue $81.6bn, data-centre revenue $75.2bn) and surging AI demand drove South Korea’s KOSPI above 8,000. SK Hynix reported Q1 revenue of 52.58 trillion won and operating profit of 37.61 trillion won (72% margin), analysts raised targets (UBS 1.7m won, Mirae 3.2m won) and TrendForce forecasts DRAM and NAND contract prices to r
2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.trendforce.com
2026-05-26
TrendForce
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
www.businesskorea.co.kr
2026-05-26
Businesskorea
The Company Says iHBM Cuts Thermal Resistance By Over 30%
SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)
SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
stocktwits.com
2026-05-26
Stocktwits
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2026-05-26
simplywall.st
2026-05-26
simplywall.st
__fail__
2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Dell Technologies introduces Dell Deskside Agentic AI, a new addition to the Dell AI Factory with NVIDIA that gives workgroups the ability to deploy and scale agentic AI workflows locally without the cost, latency and data sovereignty constraints of cloud-only approaches.
With the NVIDIA OpenShell runtime now supported across the entire Dell AI Factory with NVIDIA, enterprises benefit from a sin
2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025
2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
SK hynix unveils 'iHBM' thermal solution to boost AI performance
NEWS PROVIDED BY
SK hynix Inc.
May 25, 2026, 19:39 ET
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Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–
2026-05-26
markets.ft.com
2026-05-26
Financial Times
SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-