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2026-06-10
vir.com.vn
2026-06-10
Vietnam Investment Review - VIR
HANOI, VIETNAM - Media OutReach Newswire – 9 June 2026 – VinRobotics, Vingroup's pioneering robotics company, today announced the signing of a Memorandum of Understanding (MoU) with Infineon Technologies AG, a global semiconductor leader in power systems and IoT, to explore collaboration opportunities in building next-generation robotics applications based on advanced semiconductor technology. The
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June.
Picture: ROHM’s new top-side-cooling package for SiC MOSFETs.
By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performa
2026-06-10
technode.global
2026-06-10
TNGlobal
Malaysia-based fabless custom chip design company GreatAsic has raised $6.9 million in a Pre-Series A round led by Vertex Ventures Southeast Asia & India, with participation from Ehsan Kapital and Gobi Partners.
In a statement on Tuesday, Vertex Ventures said the investment is in line with Malaysia developing front-end chip design capabilities beyond its traditional role in semiconductor assembly
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented
2026-06-10
www.bisinfotech.com
2026-06-10
Bisinfotech
www.bisinfotech.com
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2026-06-10
www.bloomberg.com
2026-06-10
Bloomberg.com
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2026-06-10
www.thefoothillsfocus.com
2026-06-10
The Foothills Focus
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2026-06-10
www.astutegroup.com
2026-06-10
Astute Group
www.astutegroup.com
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2026-06-10
finance.yahoo.com
2026-06-10
Yahoo Finance
TSMC Reports 30% Sales Growth In May, But Stock Remains Under Pressure Over Potential Taiwan Chip Curbs
TSMC Reports 30% Sales Growth In May, But Stock Remains Under Pressure Over Potential Taiwan Chip Curbs · Stocktwits
Yuvraj Malik
Tue, June 9, 2026 at 11:57 PM PDT 2 min read
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Taiwan is reportedly considering stricter export
2026-06-10
www.digitimes.com
2026-06-10
digitimes
Nvidia CEO Jensen Huang's multi-day trip to South Korea put the "triangle relationship" among Samsung Electronics, SK Hynix, and Nvidia over high-bandwidth memory (HBM) in the spotlight, even as he toured AI factories and sealed partnerships in robotics and...
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2026-06-10
simplywall.st
2026-06-10
simplywall.st
United States/Semiconductors/NasdaqGS:TXN
Texas Instruments Battery Monitor Highlights EV And Energy Storage Growth Story
June 10, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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Texas Instruments (NasdaqGS:TXN) has introduced the BQ79826Z-Q1 battery monitor for electric vehicles and energy storage systems.
The device offers industry-leading cell-count capacity and uses electroche
2026-06-10
simplywall.st
2026-06-10
simplywall.st
United States/Semiconductors/NasdaqCM:RGTI
Rigetti Stock Reacts As 108 Qubit Launch Meets CHIPS Act Support
June 10, 2026
Simply Wall St
Reviewed by Bailey Pemberton
Rigetti Computing launched its 108 qubit Cepheus 1 108Q quantum processor for broad access on major cloud platforms.
The company agreed a non binding deal with the U.S. Commerce Department for up to $100 million in CHIPS Act funding,
2026-06-10
www.manilatimes.net
2026-06-10
The Manila Times
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (
2026-06-10
finance.yahoo.com
2026-06-10
Yahoo Finance
How Record Margins, AI Demand Visibility and Singapore Expansion At Applied Materials (AMAT) Has Changed Its Investment Story
Simply Wall St
Tue, June 9, 2026 at 11:16 PM PDT 3 min read
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In recent days, Applied Materials reported record quarterly revenue and its highest gross margin in more than two decades, raised its semiconductor equipment g
2026-06-10
news.google.com
2026-06-10
CNBC
2026-06-10
finance.yahoo.com
2026-06-10
Yahoo Finance
ON Semiconductor Extends Power Reach With GaNEXUS For AI And Industry
Simply Wall St
Wed, June 10, 2026 at 2:16 AM AST 4 min read
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ON Semiconductor (NasdaqGS:ON) has introduced its GaNEXUS gallium nitride power portfo
2026-06-10
www.electronicsweekly.com
2026-06-10
Electronics Weekly
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2026-06-10
www.electronicsweekly.com
2026-06-10
Electronics Weekly
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2026-06-10
www.investing.com
2026-06-10
Investing.com
www.investing.com
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2026-06-10
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2026-06-10
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