Semiconductor News & Analysis Feed
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2026-06-10
simplywall.st
2026-06-10
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United States/Semiconductors/NasdaqGS:NVDA
NVIDIA (NVDA) Is Down 6.6% After New Korea‑Led AI Factory Alliances and Platform Launches
June 10, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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NVIDIA recently announced a wave of alliances in South Korea and beyond, including multi‑year deals with SK hynix, SK Telecom, NAVER and LG, alongside the rollout of its Vera Rubin and DSX platf
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-10
www.marketbeat.com
2026-06-10
MarketBeat
Erste Asset Management GmbH Has $2.24 Million Position in Cadence Design Systems, Inc. $CDNS
Written by MarketBeat
June 10, 2026
Image from MarketBeat Media, LLC.
KEY POINTS
Erste Asset Management GmbH cut its Cadence Design Systems stake by 59.1% in the fourth quarter, selling 10,196 shares and leaving it with 7,052 shares valued at about $2.24 million.
Insiders have been selling shares as well.
2026-06-10
seekingalpha.com
2026-06-10
Seeking Alpha
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2026-06-10
seekingalpha.com
2026-06-10
Seeking Alpha
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2026-06-10
www.fool.com
2026-06-10
The Motley Fool
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2026-06-10
news.google.com
2026-06-10
MarketBeat
2026-06-10
vir.com.vn
2026-06-10
Vietnam Investment Review - VIR
HANOI, VIETNAM - Media OutReach Newswire – 9 June 2026 – VinRobotics, Vingroup's pioneering robotics company, today announced the signing of a Memorandum of Understanding (MoU) with Infineon Technologies AG, a global semiconductor leader in power systems and IoT, to explore collaboration opportunities in building next-generation robotics applications based on advanced semiconductor technology. The
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June.
Picture: ROHM’s new top-side-cooling package for SiC MOSFETs.
By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performa
2026-06-10
technode.global
2026-06-10
TNGlobal
Malaysia-based fabless custom chip design company GreatAsic has raised $6.9 million in a Pre-Series A round led by Vertex Ventures Southeast Asia & India, with participation from Ehsan Kapital and Gobi Partners.
In a statement on Tuesday, Vertex Ventures said the investment is in line with Malaysia developing front-end chip design capabilities beyond its traditional role in semiconductor assembly
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented
2026-06-10
www.bisinfotech.com
2026-06-10
Bisinfotech
www.bisinfotech.com
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2026-06-10
www.thefoothillsfocus.com
2026-06-10
The Foothills Focus
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2026-06-10
Yahoo Finance
TSMC Reports 30% Sales Growth In May, But Stock Remains Under Pressure Over Potential Taiwan Chip Curbs
TSMC Reports 30% Sales Growth In May, But Stock Remains Under Pressure Over Potential Taiwan Chip Curbs · Stocktwits
Yuvraj Malik
Tue, June 9, 2026 at 11:57 PM PDT 2 min read
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2026-06-10
www.digitimes.com
2026-06-10
digitimes
Nvidia CEO Jensen Huang's multi-day trip to South Korea put the "triangle relationship" among Samsung Electronics, SK Hynix, and Nvidia over high-bandwidth memory (HBM) in the spotlight, even as he toured AI factories and sealed partnerships in robotics and...
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2026-06-10
simplywall.st
2026-06-10
simplywall.st
United States/Semiconductors/NasdaqGS:TXN
Texas Instruments Battery Monitor Highlights EV And Energy Storage Growth Story
June 10, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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Texas Instruments (NasdaqGS:TXN) has introduced the BQ79826Z-Q1 battery monitor for electric vehicles and energy storage systems.
The device offers industry-leading cell-count capacity and uses electroche
2026-06-10
simplywall.st
2026-06-10
simplywall.st
United States/Semiconductors/NasdaqCM:RGTI
Rigetti Stock Reacts As 108 Qubit Launch Meets CHIPS Act Support
June 10, 2026
Simply Wall St
Reviewed by Bailey Pemberton
Rigetti Computing launched its 108 qubit Cepheus 1 108Q quantum processor for broad access on major cloud platforms.
The company agreed a non binding deal with the U.S. Commerce Department for up to $100 million in CHIPS Act funding,
2026-06-10
www.manilatimes.net
2026-06-10
The Manila Times
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (