Semiconductor News & Analysis Feed

481 articles
2026-06-27
www.gsmarena.com 2026-06-27 GSMArena.com
We've heard rumors that Qualcomm will launch two 2nm chips under the Snapdragon 8 Elite series this year, called the Snapdragon 8 Elite Gen 6 (SM8950) and Snapdragon 8 Elite Gen 6 Pro (SM8975). But now we learn that Qualcomm has two more Snapdragon 8-series chips on its roadmap. The word comes from reliable tipster Digital Chat Station, who claimed that Qualcomm is working on the Snapdragon 8 Eli
2026-06-26
www.phoronix.com 2026-06-26 Phoronix
How NVIDIA GB10 CPU Performance Compares To Vera Written by Michael Larabel in Processors on 26 June 2026 at 11:50 AM EDT. Page 1 of 4. 3 Comments. Since delivering NVIDIA Vera CPU benchmarks one month ago and follow-ups like how the ARM Linux server performance has evolved in 8 years or how Vera compares to Ampere Altra that is still quite common in the marketplace, another frequent discussion p
2026-06-26
tomshardware.com 2026-06-26 Anton Shilov
IBM's new 0.7nm-class fabrication process uses nanostack transistors, requires 2x more FEOL steps for massive improvements in performance, power, and area.
2026-06-26
www.tomshardware.com 2026-06-26 Tom's Hardware
Tech Industry Manufacturing Semiconductors IBM goes sub-1nm, develops 0.7nm-class technology — offering up to 50% higher performance and 70% higher energy efficiency compared to IBM's 2nm-class node News By Anton Shilov published June 26, 2026 It uses two wafers instead of one, along with ultra-thin dielectric bonding (Image credit: IBM) Share this article 5 Join the conversation Follow us Add
2026-06-26
www.marketbeat.com 2026-06-26 MarketBeat
RFG Advisory LLC Decreases Stock Position in Texas Instruments Incorporated $TXN Written by MarketBeat June 26, 2026 Image from MarketBeat Media, LLC. KEY POINTS RFG Advisory LLC cut its Texas Instruments stake by 34.3% in the first quarter, selling 11,027 shares and leaving it with 21,139 shares valued at about $4.1 million. Texas Instruments reported Q1 earnings of $1.68 per share, topping estim
2026-06-26
digitimes.com 2026-06-26
Qualcomm used its Investor Day to formally launch Dragonfly, a new data center product line aimed at cloud AI, and set out an ambitious revenue path that would shrink its dependence on handset sales. The company said the plan could reshape its business mix by 2029, but it still faces questions over timing, product performance, and execution.
2026-06-26
digitimes.com 2026-06-26
Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused M7 Pro and M7 Max processors to market in 2027, according to a Bloombergreport citing people familiar with the matter.
2026-06-25
tomshardware.com 2026-06-25 Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
digitimes.com 2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com 2026-06-25
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide. Market talk suggests the company may build an upgraded triggerfish product for Google, underscoring how global chipmakers are vying for influence in TPU development.
2026-06-25
semiengineering.com 2026-06-25 Liz Allan
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
2026-06-25
eetimes.com 2026-06-25
Cheap, autonomous drones developed in Ukraine are driving a new era of drone-on-drone warfare.
2026-06-25
tomshardware.com 2026-06-25 Anton Shilov
Broadcom and OpenAI reveal their Jalapeño custom-built inference ASIC that allegedly beats existing leading-edge in terms of performance-per-watt.
2026-06-25
tomshardware.com 2026-06-25 Luke James
PremiumChina's LineShine supercomputer has taken the top spot on the 67th TOP500 list, posting 2.198 exaflops on the High Performance Linpack benchmark.
2026-06-24
tomshardware.com 2026-06-24 Etiido Uko
Meta has paused an internal AI training program after employee conversations, keystrokes, transcripts, and performance-related data were reportedly exposed across the company.
2026-06-24
metrology.news 2026-06-24 Metrology and Quality News
Nearfield Raises $380M to Advance AI-Era Semiconductor Metrology June 24, 2026 Nearfield Instruments, a leader in advanced semiconductor 3D metrology and process control, has announced the successful closure of a $380 million Series-D funding round. The transaction values the company at $1.6 billion, marking a major milestone in Nearfield’s development into a global leader in semiconductor metrol
2026-06-24
www.sony-semicon.com 2026-06-24 sony-semicon.com
Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the LYTIA 610, a 1/2-type approximately 64-effective megapixel CMOS image sensor with the RB2×2 On Chip Lens (OCL) pixel structure. This is the industry’s first*1 product with this pixel structure to be mass produced. By combining the RB2×2 OCL pixel structure with dedicated array conversion processing (remosa
2026-06-24
www.prnewswire.com 2026-06-24 PR Newswire
Sony Semiconductor Solutions to Release Advanced 1/2-type CMOS Sensor for Mobile Applications Featuring Industry's First*1 RB2×2 OCL Pixel Structure for Both High Resolution and AF Performance NEWS PROVIDED BY Sony Semiconductor Solutions Corporation Jun 23, 2026, 22:00 ET SHARE THIS ARTICLE New pixel design and algorithm deliver more than 20% higher definition compared to Sony's convent
2026-06-24
digitimes.com 2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-24
www.marketwatch.com 2026-06-24 MarketWatch
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