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20 articles
Trending Companies
Nvidia46 NVIDIA18 Apple7 Samsung Electronics6 TSMC4 Samsung4 SK Hynix4 Intel4 Google4 Anthropic3 Vadzo Imaging3 Onsemi3
Trending Technologies
AI14 GaN7 Memory4 Edge AI3 AI Infrastructure3 Physical AI3 Nemotron 3.5 Transcribe3 RISC-V3 DRAM3 Data Center2 Vera Rubin2 GeForce NOW2
2026-10-21
AI infrastructure faces four hurdles: Power, construction, technology, funding
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digitimes.com 2026-10-21
2026-10-19
2026 IMPACT | SHINKO Reveals the Next Evolution of AI Advanced Packaging Substrates: From ABF and Glass Core to Hybrid RDL - semivision
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tspasemiconductor.substack.com 2026-10-19
2026-10-14
Qualcomm says edge AI faces power, cost, and scale hurdles
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digitimes.com 2026-10-14
2026-10-13
Samsung's US$9B chip expansion faces funding, supply hurdles
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digitimes.com 2026-10-13
2026-10-12
SK Hynix's US$299 billion chip plan faces military base hurdle
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digitimes.com 2026-10-12
2026-10-09
Cercis Semiconductor Auto-Grade Chip Shipments Top 10 Million, RISC-V Clears Another Hurdle - Gasgoo
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autonews.gasgoo.com 2026-10-09
2026-09-26
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles - digitimes
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www.digitimes.com 2026-09-26
2026-09-26
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles
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digitimes.com 2026-09-26
2026-09-16
South Korean NPU startups face validation hurdle in push for global sales
0.92
digitimes.com 2026-09-16
2026-09-14
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
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digitimes.com 2026-09-14
2026-09-13
Chinese breakthrough in chip material aims to clear hurdle for next-gen memory - South China Morning Post
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www.scmp.com 2026-09-13
2026-09-12
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
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digitimes.com 2026-09-12
2026-09-11
Taiyo Holdings Achieves 700-nm RDL Formation for Advanced Packaging - ChemAnalyst
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news.google.com 2026-09-11
2026-09-11
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
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digitimes.com 2026-09-11
2026-09-11
China's DRAM supply chain clears another materials hurdle
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digitimes.com 2026-09-11
2026-09-10
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-09-10
2026-09-08
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
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digitimes.com 2026-09-08
2026-09-02
AMD unveils 3D DRAM efficiency data: Hybrid bonding architecture delivers 17x improvement over HBM, thermal management remains biggest hurdle to mass production - finance.biggo.com
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finance.biggo.com 2026-09-02
2026-09-01
AMD Says A Hybrid-Bonded 3D DRAM Is 17x More Energy Efficient Than An HBM Stack That Relies On Microbumps, But Thermal Hurdles Block Commercialization - Wccftech
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wccftech.com 2026-09-01
2026-09-01
Japanese play for SK Hynix chip plant faces South Korean policy hurdles - Nikkei Asia
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asia.nikkei.com 2026-09-01
Japan's Miyagi prefecture is seeking to attract SK Hynix to build a state-of-the-art memory chip plant, but faces competition from Washington and Seoul's reluctance to approve new foreign facilities due to concerns over technology leakage. This situation highlights the growing geopolitical significa
Semiconductor ManufacturingSK HynixJapanese InvestmentSouth Korean PolicyChip FactoryTechnology TransferGeopoliticsMemory Chip