Semiconductor News & Analysis Feed
2411 articles
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
__fail__
2026-05-29
eetimes.com
2026-05-29
Server architecture will offer up to 100 TB of DRAM per accelerator.
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-ce7f5ddade8af222" on this server.
Reference #18.8c813217.1779997989.9e64c495
https://errors.edgesuite.net/18.8c813217.1779997989.9e64c495
2026-05-29
www.tradingview.com
2026-05-29
TradingView
__fail__
2026-05-29
www.techedt.com
2026-05-29
Tech Edition
Huawei has unveiled a new chip design strategy to overcome US sanctions and improve processor performance.
Huawei has announced a new chip design strategy that it believes could help the company overcome the impact of long-running US sanctions and develop processors with performance levels comparable to future 1.4nm-class chips.
The Chinese technology company revealed the approach nearly six yea
2026-05-29
www.msn.com
2026-05-29
MSN
__fail__
2026-05-29
news.google.com
2026-05-29
Business Wire
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/cadence-and-samsung-foundry-deepen-2nm-and-3da-ic-collaboration-to-meet-surging-ai-infrastructure-a-ce7f5ddadf8dfe21" on this server.
Reference #18.85813217.1779989089.4a6df450
https://errors.edgesuite.net/18.85813217.1779989089.4a6df450
2026-05-29
tomshardware.com
2026-05-29
Brandon Hill
TP-Link announced today the roadmap for its next-generation platform of Wi-Fi 8 (802.11bn) products.
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/energy-efficiency-becoming-most-important-chip-design-consideration-tsmc-executive-says-ce7f5ddadf89f525" on this server.
Reference #18.4d0f3417.1780028678.7b1c240
https://errors.edgesuite.net/18.4d0f3417.1780028678.7b1c240
2026-05-28
www.investing.com
2026-05-28
Investing.com
__fail__
2026-05-28
www.tradingview.com
2026-05-28
TradingView
__fail__