Semiconductor News & Analysis Feed
2380 articles
2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
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QCraft Demonstrates Urban NOA on Qualcomm's Latest Snapdragon Ride SoC, Targets 2026 Global Mass Production
Business Wire
Thu, June 11, 2026 at 12:06 AM PDT 2 min read
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QCraft is Collaborating with Qualcomm to Build a New Generation of Intelligent Dr
2026-06-11
news.futunn.com
2026-06-11
富途牛牛
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2026-06-11
digitimes.com
2026-06-11
Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new Taiwan facility, scheduled to be ready before September 2026.
2026-06-11
digitimes.com
2026-06-11
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
2026-06-11
digitimes.com
2026-06-11
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
2026-06-11
digitimes.com
2026-06-11
Andy Hock, chief strategy officer at Cerebras Systems, walked onto the Main Stage at SuperAI Singapore 2026 on Wednesday carrying the company's Wafer Scale Engine — the physical chip itself — and held it up for an audience of 10,000 before placing it next to a slide showing it to scale against Nvidia's latest B200 platform. The size difference was stark.
2026-06-11
digitimes.com
2026-06-11
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into the stock market and other asset markets. Central bank governor Chin-Long Yang said on June 10 that Taiwan remains far from systemic risk despite concerns over surging market activity.
2026-06-11
digitimes.com
2026-06-11
Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.
2026-06-11
digitimes.com
2026-06-11
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure aimed at activating assets and focusing on its core business. It is also intended to improve the group's capital allocation efficiency, optimize its balance sheet, and boost earnings per share (EPS).
2026-06-11
digitimes.com
2026-06-11
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-11
eetimes.com
2026-06-11
Pablo Valerio
Gartner's VP analyst David Gonzalez shares strategies for profitability and technology in supply chain management.
2026-06-11
digitimes.com
2026-06-11
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating c
2026-06-11
www.digitimes.com
2026-06-11
digitimes
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
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2026-06-11
www.investing.com
2026-06-11
Investing.com
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2026-06-11
www.barchart.com
2026-06-11
Barchart
A concept image showing a ray of light passing through cyberspace_ Image by metamorworks via Shutterstock_
Quantum computing just got its “Uncle Sam” moment.
The U.S. government is investing more than $2 billion into quantum initiatives, and that changes the conversation. This is no longer just a futuristic science project buried inside research labs. It’s becoming a national technology race, a
2026-06-11
news.iu.edu
2026-06-11
News at IU
INDIANAPOLIS — The Indiana University Launch Accelerator for Biosciences has announced a collaboration with the NVIDIA Inception program to support startups within the IU LAB Bio Start-up Center. This engagement will provide healthcare and biotech startups within the IU LAB ecosystem with unparalleled access to world-class artificial intelligence tools, technical expertise and a global network of
2026-06-11
developer.nvidia.com
2026-06-11
NVIDIA Developer
Developers building real-time AI—such as chat assistants, copilots, and agentic workflows—are often constrained by token-by-token generation speed. This limits responsiveness, increases serving costs, and makes fluid, interactive experiences difficult to achieve.
DiffusionGemma, created by Google DeepMind and optimized to run efficiently across NVIDIA platforms, introduces a new approach to tex
2026-06-11
blogs.nvidia.com
2026-06-11
NVIDIA Blog
NVIDIA Accelerates Google DeepMind’s DiffusionGemma for Local AI
The new Diffusion Gemma open model generates text in parallel — not one token at a time — and is optimized to run on the NVIDIA RTX PRO platform, NVIDIA DGX Spark systems and GeForce RTX GPUs.
June 10, 2026 by Michael Fukuyama
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Today, Google DeepMind released DiffusionGemma — an experimental open model built for exceptional
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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