Semiconductor News & Analysis Feed
2345 articles
2026-06-26
www.globenewswire.com
2026-06-26
GlobeNewswire
Accelerates onsemi’s evolution, building on its strength in power and sensing to become a leading provider of intelligent systems — expanding from AI data centers into Physical AI
Increases onsemi’s total addressable market by $30 billion to $243 billion by 2030
Positions onsemi at the intersection of Power, Sense, Connected Compute and Control — the four pillars of Physical AI — which enable mach
2026-06-26
www.cnbc.com
2026-06-26
CNBC
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2026-06-26
finance.yahoo.com
2026-06-26
Yahoo Finance
Strong Earnings Demonstrate Taiwan Semiconductor Manufacturing Company Limited’s (TSM) Key Role in The AI-Capex Cycle
Soumya Eswaran
Thu, June 25, 2026 at 9:55 AM PDT 3 min read
2330.TW
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TSM
-0.32%
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Janus Henderson Investors, an investment management company, released its first-quarter 2026 investor letter for the "Global Sustainable Equity Fund". A co
2026-06-26
www.androidauthority.com
2026-06-26
Android Authority
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A compact 65W charger that can handle a phone, tablet, and even a smaller laptop is the kind of gear that earns a spot in your bag. The INIU 65W 3-Port GaN USB-C Charger is now available at a deep discount, making it an easy Prime Day 2026 deal to notice.
This charger uses a GaN design to keep the body smaller than many t
2026-06-26
www.forbes.com
2026-06-26
Forbes
INNOVATION
CLOUD
Qualcomm’s AI Data Center Bet: Inside The Dragonfly Strategy
BySteve McDowell,
Contributor.
Chief Analyst & CEO, NAND Research.
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Jun 25, 2026, 12:38pm EDTJun 25, 2026, 02:30pm EDT
Summary
Agentic AI is dramatically shifting data center economics, making inference the dominant workload and straining infrastructure with increased memory and data movement demands. Q
2026-06-25
eetimes.com
2026-06-25
The custom inference accelerator follows the hyperscaler playbook, but the AI-automated chip design process could prove the more consequential announcement.
2026-06-25
www.openpr.com
2026-06-25
openPR.com
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2026-06-25
clpmag.com
2026-06-25
Clinical Lab Products
Tecan and NVIDIA Integrate New Artificial Intelligence Capabilities into Lab Analytics Platform
Jun 25, 2026 | Analytical Software Systems, Company News, Lab Automation |
The update to the Introspect platform aims to help clinical laboratories move toward proactive operations and improved productivity.
Tecan, a provider of laboratory automation and solutions, announced the integration of a
2026-06-25
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2026-06-25
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2026-06-25
simplywall.st
2026-06-25
simplywall.st
United States/Semiconductors/NasdaqGS:NVDA
Nvidia (NVDA) Launches BioNeMo As Life Sciences Firms Roll Out Integrations
June 25, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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NVIDIA (NasdaqGS:NVDA) launched its BioNeMo Agent Toolkit this week, a domain-focused AI platform for life sciences research.
The toolkit is designed for AI agents and scientific teams to automate, reason, a
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
AMAT
-3.33%
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Trading disclosure
Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.channelnewsasia.com
2026-06-25
CNA
Singapore
Singapore looks to upgrade PayNow with reduced payment steps, integration with NETS QR
A pilot scheme to be rolled out by end-2026 will allow customers using a PayNow-enabled app to pay merchants who display a NETS QR code.
Deputy Prime Minister and Chairman for the Monetary Authority of Singapore Gan Kim Yong speaking at the ABS' 53rd Annual Dinner, Jun 25, 2026. (Photo: CNA/Wallace
2026-06-25
www.newsfilecorp.com
2026-06-25
TMX Newsfile
Tel Aviv, Israel--(Newsfile Corp. - June 25, 2026) - Eco Wave Power Global AB is pleased to share that NVIDIA has published a corporate blog featuring the Company titled "Eco Wave Power Turns Waves Into Watts With NVIDIA AI Infrastructure and Digital Twins."
Read the full article:
https://blogs.nvidia.com/blog/eco-wave-power-ai-digital-twins/
For convenience, the full text of the NVIDIA article
2026-06-25
www.tomshardware.com
2026-06-25
Tom's Hardware
Tech Industry Artificial Intelligence
Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators — touts 6x higher bandwidth-per-watt compared to HBM, 200x capacity compared to on-chip SRAM
News
By Anton Shilov published 22 hours ago
More efficient than HBM, denser than SRAM.
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall. (Image credi
2026-06-25
tomshardware.com
2026-06-25
Anton Shilov
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall.
2026-06-25
www.barrons.com
2026-06-25
Barron's
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