Semiconductor News & Analysis Feed
20 articles
2026-08-06
www.electrive.com
2026-08-06
2026-08-06
autonews.gasgoo.com
2026-08-06
2026-08-06
autonews.gasgoo.com
2026-08-06
2026-07-24
www.electronicdesign.com
2026-07-24
2026-07-21
chargedevs.com
2026-07-21
2026-07-16
www.indexbox.io
2026-07-16
2026-07-15
www.bisinfotech.com
2026-07-15
2026-07-14
news.google.com
2026-07-14
2026-07-08
www.autocarpro.in
2026-07-08
MAHLE and Infineon have collaborated to develop a specialized cooling architecture for data center power modules, addressing thermal challenges in high-current electronic systems. The project focuses on Infineon's new EasyPACK S module, designed for controlling power supply and switchgear in data ce
2026-07-08
manufacturing.economictimes.indiatimes.com
2026-07-08
MAHLE's development of a cooling unit for Infineon's power modules represents a significant advancement in thermal management for data center applications. This collaboration addresses the growing demand for efficient heat dissipation solutions in high-power density computing environments. As data c
2026-06-18
timestech.in
2026-06-18
Infineon's CIPOS Prime 1200V CoolSiC power modules are now available through Mouser Electronics, a leading NPI distributor for semiconductors and electronic components. Designed for high-performance automotive applications in xEVs, these modules integrate automotive-grade CoolSiC MOSFETs in a compac
2026-06-15
www.electronicsforyou.biz
2026-06-15
2026-06-12
www.ad-hoc-news.de
2026-06-12
Texas Instruments (TI) launched two compact isolated DC/DC power modules on June 12, 2026, targeting high-power-density designs in electric vehicles and data centers. These modules are engineered to deliver high power density while maintaining a small footprint, making them ideal for systems with ti
2026-06-12
www.digitimes.com
2026-06-12
As wide-bandgap semiconductors like silicon carbide (SiC) and gallium nitride (GaN) gain prominence in electric vehicle powertrains, electronic packaging engineers face mounting thermal challenges. The PCIM 2026 conference highlights the critical issue of thermal warping in direct-cooled EV power mo
2026-06-12
2026-06-10
www.thelec.net
2026-06-10
Infineon Technologies announced on June 8 that it will supply 1200V silicon carbide (SiC) power modules, branded as CoolSiC MOSFETs, to Siemens for use in its SENTRON 3QD2 solid-state circuit breaker system. Unlike traditional electromechanical breakers that operate on a millisecond timescale, semic
2026-06-10
www.newelectronics.co.uk
2026-06-10
The potential partnership between Nexperia and Semikron Danfoss in electric vehicle silicon carbide power modules reflects the semiconductor industry's response to the rapid growth of the EV market. This collaboration demonstrates how industry players are seeking strategic alliances to enhance compe
2026-06-09
www.electronicsmedia.info
2026-06-09
Nexperia and Semikron Danfoss have signed a Memorandum of Understanding (MoU) to explore strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The partnership combines Nexperia’s expertise in SiC semiconductor technology with Semikron Dan
2026-06-07
2026-05-27
www.newelectronics.co.uk
2026-05-27
Microchip Technology has introduced a new range of 3.3 kV silicon carbide (SiC) power modules aimed at enabling high-voltage applications, particularly in next-generation data centers and solid-state transformer (SST) designs. These modules integrate 3.3 kV SiC MOSFETs and Schottky diodes in a stand