MAHLE Collaborates With Infineon to Supply Specialized Cooling Architecture for Data Center Power Modules - Autocar Professional

MAHLE and Infineon have collaborated to develop a specialized cooling architecture for data center power modules, addressing thermal challenges in high-current electronic systems. The project focuses ... Read original →

MAHLE’s collaboration with Infineon signals a strategic pivot of automotive-grade thermal tech into high-power semiconductor infrastructure. Technically, successful validation of this architecture will force upgrades across PCB substrates, cold plate integration, and packaging—especially for SiC/GaN-based data center power modules. Regulatory pressures from the EU’s Data Centre Code of Conduct and the U.S. Inflation Reduction Act are tightening PUE limits, making advanced cooling non-optional; laggards risk cost inflation and supply chain exclusion. Competitively, legacy liquid-cooling firms like Asetek may accelerate module-level integration, while Delta Electronics (Taiwan, China) could leverage its power-thermal synergy to capture similar opportunities. Within 12–24 months, co-designed ‘chip-cooling’ platforms will become standard, elevating thermal management from peripheral support to core IP—potentially reshaping Chiplet floorplanning strategies.