Semiconductor News & Analysis Feed

TSMC and ASML are leading an industry-wide initiative to double the size of high-NA EUV photomasks, aiming to increase scanner productivity by approximately 40%. By expanding mask dimensions from 6x6 inches to 6x12 inches, the move is expected to reduce chipmaking costs and improve manufacturing eff

Recent reports indicate that Samsung Electronics and ASML have deepened their strategic partnership to advance High Numerical Aperture (High NA) EUV lithography technology. This collaboration marks a significant step forward in the global semiconductor industry's pursuit of advanced manufacturing pr

Intel has processed over one million 300mm wafers using its High-NA EUV scanners in less than two and a half years, marking a significant milestone in advanced semiconductor manufacturing. This achievement positions Intel ahead of the entire industry combined, as ASML’s High-NA EUV tools have only p

Intel has achieved a significant milestone by processing over one million 300mm wafers using its High-NA EUV scanners in less than two and a half years, surpassing the entire industry combined. This achievement highlights Intel's leadership in advanced semiconductor manufacturing and marks a key ste

Naura Technology's demonstration of selective etching process for 64-layer 3D DRAM structures represents a significant breakthrough for Chinese memory manufacturers facing restricted access to advanced EUV lithography. This development provides domestic semiconductor companies with an alternative pa