Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined

Intel has achieved a significant milestone by processing over one million 300mm wafers using its High-NA EUV scanners in less than two and a half years, surpassing the entire industry combined. This a... Read original →

Intel's achievement of over one million 300mm wafers processed using High-NA EUV in less than two and a half years marks a decisive lead over the global industry. This milestone accelerates upstream supply chain evolution, particularly in photoresist, photomasks, and inspection systems, pushing ASML and others to reassess current tool compatibility. Although still using 6-inch masks, Intel’s move toward 6×12-inch designs aims to eliminate stitching, enhancing yield and throughput. This strategic shift could redefine future lithography standards, giving Intel a competitive edge in process control and cost efficiency. Competitors like TSMC and Samsung may respond with accelerated R&D or collaborative efforts to match or surpass this capability. In the medium term, Intel’s early adoption could establish new industry benchmarks, reshaping global chip production dynamics and supply chain architecture.