Semiconductor News & Analysis Feed

Korea Electric Power Corporation (KEPCO) is negotiating with Samsung Electronics and SK Hynix to prepay 25 trillion KRW in electricity fees to support the development of semiconductor clusters in Yongin and Honam. This initiative aims to address KEPCO’s financial constraints due to its debt exceedin

The Taiwan Fair Trade Commission (FTC) is monitoring semiconductor markets for potential competition concerns, particularly regarding TSMC's market power. While the FTC has initiated investigations, no enforcement actions are currently planned. This move reflects global scrutiny over semiconductor i

Taiwan Semiconductor Manufacturing Company (TSMC) has delayed its investment in hybrid bonding technology for high-bandwidth memory (HBM), opting instead for the more mature microbump technology. This strategic shift highlights the complexities and uncertainties in advanced packaging technology deve

As the semiconductor industry faces increasing demand for higher performance and greater storage capacity, DRAM giants are actively developing 3D stacking technology to overcome traditional memory walls and performance bottlenecks. This approach significantly enhances storage density and data transf